SLVSJJ4 October   2025 SN74LVC1G09B-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   5
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1 Specifications
      1. 5.1.1 Absolute Maximum Ratings
      2. 5.1.2 ESD Ratings
      3. 5.1.3 Recommended Operating Conditions
      4. 5.1.4 Thermal Information
      5. 5.1.5 Electrical Characteristics
      6. 5.1.6 Switching Characteristics
  8. 6 Parameter Measurement Information
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Open-Drain CMOS Outputs
      2. 7.3.2 Partial Power Down (Ioff)
      3. 7.3.3 Standard CMOS Inputs
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  11. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  12. 10Revision History
  13. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

5.1.4 Thermal Information

PACKAGE PINS THERMAL METRIC(1) UNIT
RθJA RθJC(top) RθJB ΨJT ΨJB RθJC(bot)
DTX (XSON, 5) 5 313.6 137.4 253.5 69.2 259 166.7 °C/W
DBV (SOT-23, 5) 5 357.1 263.7 264.4 195.6 262.2 N/A °C/W
DCK (SOT-SC70, 5) 5 371.0 297.5 258.6 195.6 256.2 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.