SLVSJN6 October   2026 ADC168M102R-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog
        1. 6.3.1.1 Analog Inputs
        2. 6.3.1.2 Analog-to-Digital Converters (ADCs)
        3. 6.3.1.3 CONVST
        4. 6.3.1.4 CLOCK
        5. 6.3.1.5 RESET
        6. 6.3.1.6 REFIOx
      2. 6.3.2 Digital
        1. 6.3.2.1 Mode Selection Pins M0 and M1
        2. 6.3.2.2 Half-Clock Mode (Default Mode After Power-Up and Reset)
        3. 6.3.2.3 Full-Clock Mode (Allowing Conversion and Data Readout Within 1µs, Supported In Dual Output Modes)
        4. 6.3.2.4 2-Bit Counter
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down Modes and Reset
        1. 6.4.1.1 Power-Down Mode
        2. 6.4.1.2 Sleep Mode
        3. 6.4.1.3 Auto-Sleep Mode
        4. 6.4.1.4 Reset
    5. 6.5 Programming
      1. 6.5.1 Read Data Input (RD)
      2. 6.5.2 Serial Data Outputs (SDOx)
        1. 6.5.2.1 Mode I
        2. 6.5.2.2 Mode II (Half-Clock Mode Only)
        3. 6.5.2.3 Special Read Mode II (Half-Clock Mode Only)
        4. 6.5.2.4 Mode III
        5. 6.5.2.5 Fully Differential Mode IV (Half-Clock Mode Only)
        6. 6.5.2.6 Special Mode IV (Half-Clock Mode Only)
      3. 6.5.3 Programming the Reference DAC
  8. 7 Register Map
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Grounding
        2. 8.4.1.2 Digital Interface
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Electrostatic Discharge Caution
    3. 9.3 Glossary
    4. 9.4 Trademarks
    5. 9.5 Receiving Notification of Documentation Updates
    6. 9.6 Support Resources
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1.     PACKAGE OPTION ADDENDUM
    2. 11.1 Tape and Reel Information

Abstract

PACKAGING INFORMATION

Orderable part number Status
Material
type
Package | Pins Package qty | Carrier RoHS
Lead finish/Ball material
MSL rating/Peak reflow
Op temp (°C) Part marking
5962R2521601PXE Active Production VQFN (RHB) | 32 250 | SMALL T&R Yes NIPDAU Level-3-260C-168 HR -55 to 125 Q252161
5962R2521602PXE Active Production VQFN (RHB) | 32 250 | SMALL T&R Yes NIPDAU Level-3-260C-168 HR -55 to 115 Q252162
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.