SLVSL99A February   2026  – July 2026 TPUL1G113

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Characteristics
    7.     13
    8. 5.7 Switching Characteristics
    9. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 State Machine Description
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Naming Convention
      2. 7.3.2 Retriggerable One-Shot
      3. 7.3.3 Timing Mechanism and Accuracy
      4. 7.3.4 Balanced CMOS Push-Pull Outputs
      5. 7.3.5 CMOS Schmitt-Trigger Inputs
      6. 7.3.6 Latching Logic with Known Power-Up State
      7. 7.3.7 Partial Power Down (Ioff)
      8. 7.3.8 Wettable Flanks
      9. 7.3.9 Clamp Diode Structure
    4. 7.4 Device Functional Modes
      1. 7.4.1 Off-State Operation
      2. 7.4.2 Startup Operation
      3. 7.4.3 On-State Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 1ms Pulse Generator
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Timing Components
          2. 8.2.1.1.2 Input Considerations
          3. 8.2.1.1.3 Output Considerations
          4. 8.2.1.1.4 Power Considerations
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Edge Detector
      3. 8.2.3 Switch Debounce
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

7.3.8 Wettable Flanks

This device includes wettable flanks for at least one package. See the Features section on the front page of the datasheet where packages include this feature.

TPUL1G113 Simplified Cutaway View of Wettable-Flank QFN Package and Standard QFN Package After Soldering Figure 7-7 Simplified Cutaway View of Wettable-Flank QFN Package and Standard QFN Package After Soldering

Wettable flanks help improve side wetting after soldering, which makes QFN packages easier to inspect with automatic optical inspection (AOI). As shown in Figure 7-7, a wettable flank can be dimpled or step-cut to provide additional surface area for solder adhesion which assists in reliably creating a side fillet. See the mechanical drawing for additional details.