SLVSLR3A August   2026  – October 2026 TMUX5508 , TMUX5509

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (±15V Dual Supply)
    6. 6.6  Switching Characteristics (±15V Dual Supply)
    7. 6.7  Electrical Characteristics (±20V Dual Supply)
    8. 6.8  Switching Characteristics (±20V Dual Supply)
    9. 6.9  Electrical Characteristics (12V Single Supply)
    10. 6.10 Switching Characteristics (12V Single Supply)
    11. 6.11 Electrical Characteristics (40V Single Supply)
    12. 6.12 Switching Characteristics (40V Single Supply)
    13. 6.13 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  Transition Time
    5. 7.5  Break-Before-Make Delay
    6. 7.6  Turn-On and Turn-Off Time
    7. 7.7  Charge Injection
    8. 7.8  Off Isolation
    9. 7.9  Channel-to-Channel Crosstalk
    10. 7.10 Bandwidth
    11. 7.11 THD + Noise
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Rail-to-Rail Operation
      3. 8.3.3 1.8V Logic Compatible Inputs
      4. 8.3.4 Flat On-Resistance
      5. 8.3.5 Power-Up Sequence Free
    4. 8.4 Device Functional Modes
    5. 8.5 Truth Tables
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application - Gain Switching
      1. 9.2.1 Design Requirements
      2. 9.2.2 Application Curve
    3. 9.3 Layout
      1. 9.3.1 Layout Guidelines
      2. 9.3.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TMUX550x UNIT
D (SOIC) RSV (QFN) PW (TSSOP)
16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 76.0 42.8 95.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 37.4 27.9 33.8 °C/W
RθJB Junction-to-board thermal resistance 37.4 17.9 52.8 °C/W
ΨJT Junction-to-top characterization parameter 5.7 0.3 2.5 °C/W
ΨJB Junction-to-board characterization parameter 37.1 17.9 52.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 3.8 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.