SLVSLX9 August   2026 SN74UVP1G16-Q1

ADVANCE INFORMATION  

  1.   1
  2.   2
  3. Features
  4. Applications
  5. Description
  6. Pin Configuration and Functions
  7. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
  8. Parameter Measurement Information
  9. Overview
  10. Functional Block Diagram
  11. Detailed Description
    1. 9.1 Feature Description
      1. 9.1.1 Open-Drain CMOS Outputs
      2. 9.1.2 CMOS Schmitt-Trigger Inputs
  12. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Power Considerations
        2. 10.2.1.2 Input Considerations
        3. 10.2.1.3 Output Considerations
      2. 10.2.2 Detailed Design Procedure
    3. 10.3 Application Curves
    4. 10.4 Power Supply Recommendations
    5. 10.5 Layout
      1. 10.5.1 Layout Guidelines
      2. 10.5.2 Layout Example
  13. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  14. 12Revision History
  15. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information
    2. 13.2 Mechanical Data

Power Considerations

Verify that the desired supply voltage is within the range specified in the Electrical Characteristics. The supply voltage sets the device electrical characteristics, as described in the Electrical Characteristics section.

The positive voltage supply must be capable of sourcing current equal to the maximum static supply current, ICC, listed in the Electrical Characteristics, and any transient current required for switching.

The ground must be capable of sinking current equal to the total current to be sunk by all outputs of the SN74UVP1G16-Q1 plus the maximum supply current, ICC, listed in the Electrical Characteristics, and any transient current required for switching. The logic device can only sink as much current that can be sunk into the ground connection. Verify that the maximum total current through GND listed in the Absolute Maximum Ratings is not exceeded.

The SN74UVP1G16-Q1 can drive a load with a total capacitance less than or equal to 30 nF while still meeting all of the data sheet specifications. Larger capacitive loads can be applied; however, TI recommends adding a series resistor between the output and capacitor to prevent excessive current.

The SN74UVP1G16-Q1 can drive a load with total resistance described by RL ≥ VO / IO, with the output voltage and current defined in the Electrical Characteristics table with VOL. When outputting in the HIGH state, the output voltage in the equation is defined as the difference between the measured output voltage and the supply voltage at the VCC pin.

Total power consumption can be calculated using the information provided in the CMOS Power Consumption and Cpd Calculation application note.

Thermal increase can be calculated using the information provided in the Thermal Characteristics of Standard Linear and Logic (SLL) Packages and Devices application note.

CAUTION: The maximum junction temperature, TJ(max) listed in the Absolute Maximum Ratings, is an additional limitation to prevent damage to the device. Do not violate any values listed in the Absolute Maximum Ratings. These limits are provided to prevent damage to the device.