SLVUCU8 January 2024
The board layout for the TPS54KC23EVM is shown in Figure 4-22 through Figure 4-8. The top-side layer of the EVM is laid out in a manner typical of a user application. The top, bottom, and internal layers are 2-oz. copper. The small size U1 circuit takes up an area of only approximately 250 mm2 as shown on the silkscreen.