SLVUCY4B June   2024  – January 2025 LM5190-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Test Setup and Procedure
      1. 2.1.1 EVM Connections
      2. 2.1.2 Test Equipment
      3. 2.1.3 Recommended Test Setup
        1. 2.1.3.1 Input Connections
        2. 2.1.3.2 Output Connections
      4. 2.1.4 Test Procedure
        1. 2.1.4.1 Basic Test Procedure
  8. 3Implementation Results
    1. 3.1 Test Data and Performance Curves
      1. 3.1.1 Efficiency
      2. 3.1.2 Operating Waveforms
        1. 3.1.2.1 Start-Up and Shutdown With EN
        2. 3.1.2.2 Switching
        3. 3.1.2.3 Load Transient (CV), ISET Modulation (CC)
      3. 3.1.3 Thermal Performance
      4. 3.1.4 Bode Plot
      5. 3.1.5 EMI Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Device and Documentation Support
    1. 6.1 Device Support
      1. 6.1.1 Development Support
    2. 6.2 Documentation Support
      1. 6.2.1 Related Documentation
        1. 6.2.1.1 PCB Layout Resources
        2. 6.2.1.2 Thermal Design Resources
  12. 7Revision History

5.1 Trademarks

PowerPAD™ is a trademark of Texas Instruments.

WEBENCH® is a registered trademark of Texas Instruments.

All trademarks are the property of their respective owners.