SLVUDE5 September   2025

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Header and Jumper Information
    3. 2.3 Test Points
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1. 4.1 Trademarks

Introduction

This user’s guide describes the TMUX48XXDSGDDF-EVM evaluation module (EVM) and the intended use. This board allows for the quick prototyping and characterization of TI’s TMUX4821 and TMUX4819 multiplexers in DSG and DDF packages. This EVM allows for evaluation of the device impact on the total resistance on the signal path.

The following is continuation of the features list:

  • One 3-pin header for connecting or disconnecting device from external power
  • Two 3-pin headers for controlling the logic of the device
  • Four 3-pin headers to change signal path state of device
  • Multiple unpopulated footprints for potential additional RC loads
  • Multiple through holes for mounting resistors
CAUTION: The EVM comes with jumpers populating the headers shorting the pins to ground. Make sure before first usage you are aware about the state of the pins and change them according to your application. Failing to do so risks the reliability of the device and EVM.