This section provides a description of the TPS562242BEVM, board layout, and layer illustrations.

Figure 5-2, Figure 5-3, and Figure 5-4 show the board layout for the TPS562242BEVM. The top layer contains the main power traces for VIN, VOUT, and ground. Connections for the pins of the TPS562242B and a large area filled with ground are also on the top layer. Most of the signal traces are also located on the top side. The input decoupling capacitors C1, C2, and C3 are located as close to the IC as possible. The input and output connectors, test points, and all of the components are located on the top side. The bottom layer is a ground plane along with the signal ground copper fill and the feedback trace from the point of regulation to the top of the resistor divider network. Both the top layer and bottom layer use 2oz copper thickness.

Figure 5-5 and Figure 5-6 are the TPS562242BEVM board top view and bottom view, respectively.

Figure 5-2 TPS562242BEVM Top Assembly

Figure 5-3 TPS562242BEVM Top Layer

Figure 5-4 TPS562242BEVM Bottom Layer

Figure 5-5 TPS562242BEVM Board (Top View)

Figure 5-6 TPS562242BEVM Board (Bottom View)