SLVUDW2 August   2026

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Header and Jumper Information
    3. 2.3 Test Points
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1. 4.1 Trademarks

1.1 Introduction

This user’s guide describes the TMUXS1306EVM evaluation module (EVM) and the intended use. This board allows for the quick prototyping and characterization of TI’s TMUXS1306A multiplexers in RGE, PW, and DDF packages. This EVM allows for evaluation of the device impact on the total resistance on the signal path.

Additional features:

  • TMUXS1306ARGE pre-soldered on board
  • 24 test points: 17 I/O tes points, SPI test points, AC test point, and VDD test point
  • 17 3-pin headers to change signal path state of device
  • Multiple unpopulated footprints for potential additional RC loads
CAUTION: The EVM comes with jumpers in a side bag, these headers shorting the pins to ground or VDD. Before first use, confirm the state of the pins and adjust accordingly based on application. Failing to do so risks the reliability of the device and EVM.