SLVUDW2 August   2026

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Header and Jumper Information
    3. 2.3 Test Points
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1. 4.1 Trademarks

Features

  • External power supply with decoupling capacitor.
  • One power supply decoupling capacitor from VDD to ground (0.1µF 0402).
  • Two test points on each I/Os before and after RC ladder for full current and voltage capabilities.
  • Seven additional GND test points for ease of probing.
  • Various male and female connection headers + test points for quick testing.
  • Daisy chain capable between multiple EVMs.
  • USB2ANY Support for TMUXS1306A SPI configuration.