SLYS059D December   2025  – October 2026 TMAG5230

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Version Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Magnetic Flux Density Direction
      2. 7.3.2 Magnetic Response
      3. 7.3.3 Timing
      4. 7.3.4 Hall Element Location
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Design Requirements
    4. 8.4 Detailed Design Procedure
    5. 8.5 Application Curves
    6. 8.6 Power Supply Recommendations
    7. 8.7 Layout
      1. 8.7.1 Layout Guidelines
      2. 8.7.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical and Packaging Information
    1. 11.1 Mechanical Data

10 Revision History

Changes from August 13, 2026 to October 12, 2026 (from Revision C (August 2026) to Revision D (October 2026))

  • Added E1K and J1D variants in the Device Comparison tableGo
  • Added TMAG5230ExK to Version Characteristics TableGo

Changes from February 24, 2026 to August 13, 2026 (from Revision B (February 2026) to Revision C (August 2026))

  • Updated BOP and sampling rate information in Features listGo
  • Added information about the new I5D variant in the Device Comparison and throughout the documentGo
  • Added E1D variant in the Device Comparison tableGo
  • Added additional option information to Additional Device Configuration Options tableGo
  • Added note that DSBGA package drawing applies to both YBK and YBH packageGo
  • Added TMAG5230ExD variant to Version Characteristics TableGo
  • Added TMAG5230ExD information to Typical Characteristics sectionGo

Changes from February 10, 2026 to February 24, 2026 (from Revision A (February 2026) to Revision B (February 2026))

  • Added information about the new I5D variant in the Device Comparison and throughout the documentGo
  • Added E1D variant in the Device Comparison tableGo
  • Added TMAG5230IxD to Version Characteristics TableGo

Changes from Revision * (December 2025) to Revision A (February 2026)

  • Added YBH package characteristics to Thermal Information tableGo
  • Added IOZ parametric data to Electrical Characteristics tableGo
  • Added YBH package data for TMAG5230DxD variantGo
  • Added TMAG5230FxD to Version Characteristics TableGo
  • Added TMAG5230JxD to Version Characteristics tableGo
  • Added TMAG5230KxD to Version Characteristics tableGo
  • Added TMAG5230LxD to Version Characteristics tableGo
  • Added TMAG5230FxD, TMAG5230JxD, TMAG5230KxD, TMAG5230LxD information to Typical Characteristics sectionGo