SNIS197A August 2017 – April 2025 LM60-Q1
PRODUCTION DATA
| ORDER NUMBER | PACKAGE | ACCURACY OVER TEMPERATURE | SPECIFIED TEMPERATURE RANGE | |
|---|---|---|---|---|
| LM60BIM3X/NOPB | SOT-23 (DBZ) 3-pin | ±3°C | –25°C ≤ TA ≤ +125°C(1) (Legacy chip) | |
| –40°C ≤ TA ≤ +125°C (New chip) | ||||
| LM60CIM3X/NOPB | ±4°C | –40°C ≤ TA ≤ +125°C | ||
| LM60QIM3X/NOPB | ±4°C | –40°C ≤ TA ≤ +125°C | ||
| LM60BIZ/LFT3 | TO-92 (LP) 3-pin Formed Leads | ±3°C | –25°C ≤ TA ≤ +125°C(1) (Legacy chip) | |
| –40°C ≤ TA ≤ +125°C (New chip) | ||||
| LM60BIZ/NOPB | TO-92 (LP) 3-pin Straight Leads | ±3°C | –25°C ≤ TA ≤ +125°C(1) (Legacy chip) | |
| –40°C ≤ TA ≤ +125°C (New chip) | ||||
| LM60CIZ/NOPB | ±4°C | –40°C ≤ TA ≤ +125°C | ||
| PRODUCT | DESCRIPTION |
|---|---|
| LM60xIyyy/NOPB LM60xIyyy/LFT3 | x indicates that the device has B, C or Q (grade-1 device in
accordance with the AEC-Q100 standard) variant. These devices can ship
with the legacy chip (CSO: GF6 or SHE) or the new chip (CSO: RFB) with
different date code. The reel packaging label provides date code
information to distinguish which chip is being used. Device performance
for new and legacy chips is denoted throughout the document. yyy indicates that the package type of the device which can be M3X/NOPB (SOT-23 3-pin) or Z/LFT3 (TO-92 3-pin Formed Leads) or Z/NOPB (TO-92 3-pin Straight Leads). For more information on TO-92 package options please see: TO-92 Packing Options / Ordering Instructions |