SNIS249 May   2025 LM50-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: LM50-Q1
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LM50-Q1 Transfer Function
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Full-Range Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitive Loads
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
      3. 8.5.3 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1.      Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

4 Device Comparison

Table 4-1 Device Comparison
FeatureLM50-Q1(1)TMP235-Q1TMP236-Q1LM60-Q1(1)LMT86-Q1LMT87-Q1LM94022-Q1
Sensor gain
(mV/°C)		101019.56.25–10.9–13.6–5.5/–8.2
–10.9/–13.6
Sensor gain typeFixedFixedFixedFixedFixedFixedPin-Set
Offset (at 0°C)
(mV)		500500400424210326371.035/1.57
2.103/2.637
Temp Range (°C)-40 to 125-40 to 150-10 to 125-40 to 125-50 to 150-50 to 150-50 to 150
Power Supply Specifications
VDD (V)4.5 to 102.3 to 5.53.1 to 5.52.7 to 102.2 to 5.52.7 to 5.51.5/1.8/
2.2/2.7 to 5.5
IQ (typ) (µA)95910825.45.45.4
Automotive Specifications
Automotive
Grade		Grade-1Grade-0Grade-1Grade-1Grade-0Grade-0Grade-0
Functional
Safety
Capable		YesYesYesYesYesYesNo
Temperature Accuracy
25°C (typ)-±0.5±0.5-±0.3±0.3-
-50°C (max)----±2.7±2.7±1.8
-40°C (max)±4±2.5-±4±2.7±2.7±1.8
-25°C (max)±3.8±2.5-±3.8±2.7±2.7±1.8
-10°C (max)±3.5±2.5±2.5±3.5±2.7±2.7±1.8
0°C (max)±3.4-1.5/1.2±2.5±3.4±2.7±2.7±1.8
20°C (max)±3.1-1.5/1.2±2.5±3.1±2.7±2.7±1.5
25°C (max)±3-1.5/1.2±2.5±3±2.7±2.7±1.5
40°C (max)±3.15-1.5/1.2±2.5±3.15±2.7±2.7±1.5
70°C (max)±3.45-1.5/1.2±2.5±3.45±2.7±2.7±1.8
85°C (max)±3.6±2.5±2.5±3.6±2.7±2.7±2.1
90°C (max)±3.65±2.5±2.5±3.65±2.7±2.7±2.1
120°C (max)±3.95±2.5±2.5±3.95±2.7±2.7±2.4
125°C (max)±4±2.5±2.5±4±2.7±2.7±2.7
150°C (max)-±2.5--±2.7±2.7±2.7
Packaging Dimension
Dimensions
[mm × mm × mm]		SOT23
(3-pin)
2.9 × 2.4 × 1.1		SOT23
(3-pin)
2.9 × 2.4 × 1.1
SC70
(5-pin)
2.0 × 2.1 × 1.1		SOT23
(3-pin)
2.9 × 2.4 × 1.1		SOT23
(3-pin)
2.9 × 2.4 × 1.1
SC70
(5-pin)
2.0 × 2.1 × 1.1		SC70
(5-pin)
2.0 × 2.1 × 1.1		SC70
(5-pin)
2.0 × 2.1 × 1.1
  1. LM50-Q1 and LM60-Q1 temperature accuracy limits come from the "Accuracy vs Temperature" plot.
Table 4-2 LM50/LM50-Q1 Device Orderable Options
ORDER NUMBERPACKAGEACCURACY OVER TEMPERATURE SPECIFIED TEMPERATURE RANGE
LM50BIM3SOT-23
(DBZ)
3-pin

±3°C

–25°C ≤ TA ≤ +100°C
LM50BIM3X/NOPB(1)–25°C ≤ TA ≤ +100°C
(Legacy chip)
–40°C ≤ TA ≤ +125°C
(New chip)
LM50CIM3±4°C –40°C ≤ TA ≤ +125°C
LM50CIM3X
LM50CIM3X/NOPB–40°C ≤ TA ≤ +125°C
(Both legacy & new chip)
LM50QIM3X/NOPB±4°C–40°C ≤ TA ≤ +125°C
(Both legacy & new chip)
  1. LM50BIM3X/NOPB (Legacy chip) operates from –25°C to 100°C while LM50BIM3X/NOPB (New chip) operates from –40°C to 125°C.
Table 4-3 LM50/LM50-Q1 Device Nomenclature Detail
PRODUCTDESCRIPTION
LM50xIyyyx indicates that the device has B, C or Q (grade-1 device in accordance with the AEC-Q100 standard) variant. These devices can ship with the legacy chip (CSO: GF6 or SHE) or the new chip (CSO: RFB) with different chip source origin (CSO). The reel packaging label provides date code information to distinguish which chip is being used. Device performance for new and legacy chips is denoted throughout the document.
yyy indicates that the package type of the device which can be M3, M3X and M3X/NOPB all in SOT-23 3-pin package.