SNOA961A February   2017  – February 2023 LDC2112 , LDC2114 , LDC3114 , LDC3114-Q1

 

  1.   Inductive Touch System Design Guide for HMI Button Applications
  2. 1Mechanical Design
    1. 1.1 Theory of Operation
    2. 1.2 Button Construction
    3. 1.3 Mechanical Deflection
    4. 1.4 Mechanical Factors that Affect Sensitivity
      1. 1.4.1 Target Material Selection
        1. 1.4.1.1 Material Stiffness
        2. 1.4.1.2 Material Conductivity
      2. 1.4.2 Button Geometry
      3. 1.4.3 Spacing Between Target and Sensor
    5. 1.5 Layer Stacks of Touch Buttons
      1. 1.5.1 Conductive Surface
      2. 1.5.2 Non-Conductive Surface
    6. 1.6 Sensor Mounting Reference
    7. 1.7 Sensor Mounting Techniques
      1. 1.7.1 Adhesive-Based
      2. 1.7.2 Spring-Based
      3. 1.7.3 Slot-Based
    8. 1.8 Mechanical Isolation
  3. 2Sensor Design
    1. 2.1 Overview
      1. 2.1.1 Sensor Electrical Parameters
      2. 2.1.2 Sensor Frequency
      3. 2.1.3 Sensor RP and RS
      4. 2.1.4 Sensor Inductance
      5. 2.1.5 Sensor Capacitance
      6. 2.1.6 Sensor Quality Factor
    2. 2.2 Inductive Touch
    3. 2.3 LDC211x/LDC3114 Design Boundary Conditions
    4. 2.4 Sensor Physical Construction
      1. 2.4.1 Sensor Physical Size
      2. 2.4.2 Sensor Capacitor Position
      3. 2.4.3 Shielding INn traces
      4. 2.4.4 Shielding Capacitance
      5. 2.4.5 CCOM Sizing
      6. 2.4.6 Multi-Layer Design
        1. 2.4.6.1 Sensor Parasitic Capacitance
      7. 2.4.7 Sensor Spacers
      8. 2.4.8 Sensor Stiffener
      9. 2.4.9 Racetrack Inductor Shape
    5. 2.5 Example Sensor
  4. 3Summary
  5. 4Revision History

Adhesive-Based

The most straight-forward method for mounting the sensors is to apply adhesive to the spacers and glue them to the metal target. The adhesive-based system does not require additional mechanical pieces and is suitable for quick prototyping. The downside is that the glue attachment process is less repeatable.

#T4726003-26 shows an image of the two side buttons on a phone case prototype. The size of each button coil is 8 mm × 2.7 mm. The inside of the case is recessed to make room for the coils. This not only reduces the board area used by the coils, but also reduces the rigidity of the metal sidewall and enhances sensitivity.

GUID-CDF1618A-FDAC-4A25-A3E7-589C560C20F0-low.pngFigure 1-10 Adhesive-Based Sensor Structure