SNOS879J August   1999  – December 2025 LM7301

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: 2.7V to 32V DC
    6. 5.6  Electrical Characteristics: AC
    7. 5.7  Electrical Characteristics: 30-V DC
    8. 5.8  Typical Characteristics
    9. 5.9  Old Versus New Die Comparison
    10. 5.10 Slew rate
  7. 6 Power Supply Recommendations
  8. 7 Layout
    1. 7.1 Layout Guidelines
    2. 7.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Support Resources
    2. 8.2 Trademarks
    3. 8.3 Electrostatic Discharge Caution
    4. 8.4 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)LM7301UNIT
DBV (SOT-23)D (SOIC)
5 PINS8 PINS
RθJAJunction-to-ambient thermal resistance169120°C/W
RθJC(top)Junction-to-case (top) thermal resistance12265°C/W
RθJBJunction-to-board thermal resistance3061°C/W
ψJTJunction-to-top characterization parameter1716°C/W
ψJBJunction-to-board characterization parameter2960°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the TI application note Semiconductor and IC Package Thermal Metrics.