SNOS879J August   1999  – December 2025 LM7301

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: 2.7V to 32V DC
    6. 5.6  Electrical Characteristics: AC
    7. 5.7  Electrical Characteristics: 30-V DC
    8. 5.8  Typical Characteristics
    9. 5.9  Old Versus New Die Comparison
    10. 5.10 Slew rate
  7. 6 Power Supply Recommendations
  8. 7 Layout
    1. 7.1 Layout Guidelines
    2. 7.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Support Resources
    2. 8.2 Trademarks
    3. 8.3 Electrostatic Discharge Caution
    4. 8.4 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

7.1 Layout Guidelines

For best operational performance of the device, TI recommends good printed-circuit board (PCB) layout practices. Low-loss, 0.1-μF bypass capacitors should be connected between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable to single supply applications.