SNOSDK3 September   2024 TLV3603-EP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Diagrams
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Inputs
      2. 6.4.2 Push-Pull (Single-Ended) Output
      3. 6.4.3 Known Startup Condition
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Adjustable Hysteresis
      2. 7.1.2 Capacitive Loads
      3. 7.1.3 Latch Functionality
    2. 7.2 Typical Application
      1. 7.2.1 Implementing Adjustable Hysteresis
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Optical Receiver
      3. 7.2.3 Over-Current Latch Condition
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TLV3603-EP UNIT
DBV (SOT-23)
6 PINS
RθJA Junction-to-ambient thermal resistance 191.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 117.1 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance 79.1 °C/W
RθJB Junction-to-board thermal resistance 56.7 °C/W
ψJT Junction-to-top characterization parameter 78.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.