SNOSDL4 June   2025 LMG2656

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 GaN Power FET Switching Parameters
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  GaN Power FET Switching Capability
      2. 7.3.2  Turn-On Slew-Rate Control
      3. 7.3.3  Current-Sense Emulation
      4. 7.3.4  Bootstrap Diode Function
      5. 7.3.5  Input Control Pins (EN, INL, INH, GDH)
      6. 7.3.6  INL - INH Interlock
      7. 7.3.7  AUX Supply Pin
        1. 7.3.7.1 AUX Power-On Reset
        2. 7.3.7.2 AUX Under-Voltage Lockout (UVLO)
      8. 7.3.8  BST Supply Pin
        1. 7.3.8.1 BST Power-On Reset
        2. 7.3.8.2 BST Under-Voltage Lockout (UVLO)
      9. 7.3.9  Overcurrent Protection
      10. 7.3.10 Overtemperature Protection
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 LLC Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 AHB Application
      3. 8.2.3 Motor Drives Application
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Solder-Joint Stress Relief
        2. 8.4.1.2 Signal-Ground Connection
        3. 8.4.1.3 CS Pin Signal
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.7 Typical Characteristics


LMG2656 Low-Side Normalized Drain-Source On-Resistance vs Junction Temperature

Figure 5-1 Low-Side Normalized Drain-Source On-Resistance vs Junction Temperature

LMG2656 Low-Side Drain Current Turn-On Delay Time vs Junction Temperature

Figure 5-3 Low-Side Drain Current Turn-On Delay Time vs Junction Temperature

LMG2656 High-Side Drain Current Turn-On Delay Time vs Junction Temperature

Figure 5-5 High-Side Drain Current Turn-On Delay Time vs Junction Temperature

LMG2656 AUX Standby Current vs Junction Temperature

EN = 0V
Figure 5-7 AUX Standby Current vs Junction Temperature

LMG2656 AUX Quiescent Current vs Junction Temperature

INL = 5V
Figure 5-9 AUX Quiescent Current vs Junction Temperature

LMG2656 BST Quiescent Current vs Junction Temperature

INH = 0V
Figure 5-11 BST Quiescent Current vs Junction Temperature

LMG2656 BST Operating Current vs Frequency

Figure 5-13 BST Operating Current vs Frequency

LMG2656 High-Side Normalized Drain-Source On-Resistance vs Junction Temperature

Figure 5-2 High-Side Normalized Drain-Source On-Resistance vs Junction Temperature

LMG2656 Low-Side Turn-Off Delay Time vs Junction Temperature

Figure 5-4 Low-Side Turn-Off Delay Time vs Junction Temperature

LMG2656 High-Side Turn-Off Delay Time vs Junction Temperature

Figure 5-6 High-Side Turn-Off Delay Time vs Junction Temperature

LMG2656 AUX Quiescent Current vs Junction Temperature

INL = 0V
Figure 5-8 AUX Quiescent Current vs Junction Temperature

LMG2656 AUX Operating Current vs Frequency

Figure 5-10 AUX Operating Current vs Frequency

LMG2656 BST Quiescent Current vs Junction Temperature

INH = 5V
Figure 5-12 BST Quiescent Current vs Junction Temperature