SNOSDL4 June   2025 LMG2656

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 GaN Power FET Switching Parameters
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  GaN Power FET Switching Capability
      2. 7.3.2  Turn-On Slew-Rate Control
      3. 7.3.3  Current-Sense Emulation
      4. 7.3.4  Bootstrap Diode Function
      5. 7.3.5  Input Control Pins (EN, INL, INH, GDH)
      6. 7.3.6  INL - INH Interlock
      7. 7.3.7  AUX Supply Pin
        1. 7.3.7.1 AUX Power-On Reset
        2. 7.3.7.2 AUX Under-Voltage Lockout (UVLO)
      8. 7.3.8  BST Supply Pin
        1. 7.3.8.1 BST Power-On Reset
        2. 7.3.8.2 BST Under-Voltage Lockout (UVLO)
      9. 7.3.9  Overcurrent Protection
      10. 7.3.10 Overtemperature Protection
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 LLC Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 AHB Application
      3. 8.2.3 Motor Drives Application
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Solder-Joint Stress Relief
        2. 8.4.1.2 Signal-Ground Connection
        3. 8.4.1.3 CS Pin Signal
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.6 Switching Characteristics

1) Symbol definitions: VDS(ls) = SW to SL voltage; IDS(ls) = SW to SL current; VDS(hs) = DH to SW voltage; ID(hs) = DH to SW current; ISW = SW point current into device; 2) Unless otherwise noted: voltage, resistance, and capacitance are respect to AGND; –40°C ≤ TJ ≤ 125°C; VDS(ls) = 520V; VDS(hs) = 520V; 10V ≤ VAUX ≤ 26V; 7.5V ≤ VBST_SW ≤ 26V; VEN = 5V; VINL = 0V; VINH = 0V; RRDRVL = 0Ω; RRDRVH_SW = 0Ω; RCS = 100Ω
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
LOW-SIDE GAN POWER FET
td(on)(Idrain)(ls) Drain current turn-on delay time From VINL > VINL,IT+ to ID(ls) > 50mA, VBUS = 400V, ISW = 1A, at following low-side slew rate settings, see GaN Power FET Switching Parameters
slew rate setting 0 (slowest) 112 ns
slew rate setting 1 80
slew rate setting 2 76
slew rate setting 3 (fastest) 63
td(on)(ls) Turn-on delay time From VINL > VINL,IT+ to VDS(ls) < 390V, VBUS = 400V, ISW = 1A, at following low-side slew rate settings, see GaN Power FET Switching Parameters
slew rate setting 0 (slowest) 150 ns
slew rate setting 1 110
slew rate setting 2 92
slew rate setting 3 (fastest) 71
tr(on)(ls) Turn-on rise time From VDS(ls) < 320V to VDS(ls) < 80V, VBUS = 400V, ISW = 1A, at following low-side slew rate settings, see GaN Power FET Switching Parameters
slew rate setting 0 (slowest) 96 ns
slew rate setting 1 26.7
slew rate setting 2 4.8
slew rate setting 3 (fastest) 3
td(off)(ls) Turn-off delay time From VINL < VINL,IT– to VDS(ls) > 80V, VBUS = 400V, ISW = 1A, (independent of slew rate setting), see GaN Power FET Switching Parameters 50 ns
tf(off)(ls) Turn-off fall time From VDS(ls) > 80V to VDS(ls) > 320V, VBUS = 400V, ISW = 1A, (independent of slew rate setting), see GaN Power FET Switching Parameters 34 ns
Turn-on slew rate From VDS(ls) < 320V to VDS(ls) < 80V, TJ = 25℃, VBUS = 400V, ISW = 1A, at following low-side slew rate settings, see GaN Power FET Switching Parameters
slew rate setting 0 (slowest) 2.5 V/ns
slew rate setting 1 9
slew rate setting 2 50
slew rate setting 3 (fastest) 80
HIGH-SIDE GAN POWER FET
td(on)(Idrain)(hs,INH) Drain current turn-on delay time From VINH > VINH,IT+ to ID(hs) > 50mA, VBUS = 400V, ISW = –1A, at following high-side slew rate settings, see GaN Power FET Switching Parameters
slew rate setting 0 (slowest) 117 ns
slew rate setting 1 90
slew rate setting 2 80
slew rate setting 3 (fastest) 61
td(on)(hs,INH) Turn-on delay time From VINH > VINH,IT+ to VDS(hs) < 390V, VBUS = 400V, ISW = –1A, at following high-side slew rate settings, see GaN Power FET Switching Parameters
slew rate setting 0 (slowest) 200 ns
slew rate setting 1 130
slew rate setting 2 90
slew rate setting 3 (fastest) 80
tr(on)(hs) Turn-on rise time From VDS(hs) < 320V to VDS(hs) < 80V, VBUS = 400V, ISW = –1A, at following high-side slew rate settings, see GaN Power FET Switching Parameters
slew rate setting 0 (slowest) 96 ns
slew rate setting 1 26.7
slew rate setting 2 4.8
slew rate setting 3 (fastest) 3
td(off)(hs,INH) Turn-off delay time From VINH < VINH,IT– to VDS(hs) > 80V, VBUS = 400V, ISW = –1A, (independent of slew rate setting), see GaN Power FET Switching Parameters 60 ns
tf(off)(hs) Turn-off fall time From VDS(hs) > 80V to VDS(hs) > 320V, VBUS = 400V, ISW = –1A, (independent of slew rate setting), see GaN Power FET Switching Parameters 34 ns
Turn-on slew rate From VDS(hs) < 320V to VDS(hs) < 80V, TJ = 25℃, VBUS = 400V, ISW = –1A, at following high-side slew rate settings, see GaN Power FET Switching Parameters
slew rate setting 0 (slowest) 2.5 V/ns
slew rate setting 1 9
slew rate setting 2 50
slew rate setting 3 (fastest) 80
CS
tr Rise time From ICS(src) > 0.1 × ICS(src)(final) to ICS(src) > 0.9 × ICS(src)(final), 0V ≤ VCS ≤ 2V, Low-side enabled into a 1A load 30 ns
EN
EN wake-up time From VEN > VIT+ to ID(ls) > 10mA, VINL = 5V 1.5 µs
BST
Start-up time from deep BST to SW discharge From VBST_SW > VBST_SW,T+(UVLO) to high-side reacts to INH or GDH high level with VBST_SW rising from 0V to 10V in 1µs 5 µs
Start-up time from shallow BST to SW discharge From VBST_SW > VBST_SW,T+(UVLO) to high-side reacts to INH or GDH high level with VBST_SW rising from 5V to 10V in 0.5µs 2.6 µs