SNVA935A June   2020  – July 2021 LM60430 , LM60430-Q1 , LM60440 , LM60440-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Enhanced HotRod QFN – Optimized EMI Performance
    1. 2.1 Introduction
    2. 2.2 Enhanced HotRod QFN Package
    3. 2.3 Enhanced HotRod QFN Pin-Out
    4. 2.4 Comparative Analysis of EMI Results between FCOL Package and Enhanced HotRod QFN Package
  4. 3Enhanced HotRod QFN - Optimized for Manufacturing
  5. 4Enhanced HotRod QFN - Optimized for Thermals
    1. 4.1 Introduction
    2. 4.2 Enhanced HotRod QFN Thermal Performance
  6. 5Summary
  7. 6References
  8. 7Revision History

Comparative Analysis of EMI Results between FCOL Package and Enhanced HotRod QFN Package

A PCB board was developed to compare the EMI results of the LMR33630 and LM60440 devices with identical EMI input filters and PCB layout. Figure 2-10 and Figure 2-11 show the results. The results show near identical EMI performance in the high-frequency region. Consequently, the elimination of the wire bonds in the FCOL package and Enhanced HotRod QFN package lead to at least 10 dB of margin across the entire high-frequency range.

GUID-C6B2116C-9192-4839-8D0A-B6DDE9286906-low.pngFigure 2-10 Conducted EMI Low Frequency
GUID-193DEB26-6864-41D7-8E6B-CC577C9AF303-low.pngFigure 2-11 Conducted EMI High Frequency