SNVS686L March   2011  – June 2025 LMZ22005

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Synchronization Input
      2. 6.3.2 Output Overvoltage Protection
      3. 6.3.3 Current Limit
      4. 6.3.4 Thermal Protection
      5. 6.3.5 Prebiased Start-Up
    4. 6.4 Device Functional Modes
      1. 6.4.1 Discontinuous And Continuous Conduction Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 Design Steps
        3. 7.2.2.3 Enable Divider, RENT, RENB, and RENH Selection
        4. 7.2.2.4 Output Voltage Selection
        5. 7.2.2.5 Soft-start Capacitor Selection
        6. 7.2.2.6 Tracking Supply Divider Option
        7. 7.2.2.7 CO Selection
        8. 7.2.2.8 CIN Selection
        9. 7.2.2.9 Discontinuous and Continuous Conduction Modes Selection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
      3. 7.4.3 Power Dissipation and Thermal Considerations
      4. 7.4.4 Power Module SMT Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

7.4.4 Power Module SMT Guidelines

The following recommendations are for a standard module surface mount assembly

  • Land Pattern — Follow the PCB land pattern with either soldermask defined or non-soldermask defined pads.
  • Stencil Aperture
    • For the exposed die attach pad (DAP), adjust the stencil for approximately 80% coverage of the PCB land pattern.
    • For all other I/O pads, use a 1:1 ratio between the aperture and the land pattern recommendation.
  • Solder Paste — Use a standard SAC Alloy such as SAC 305, type 3 or higher.
  • Stencil Thickness — 0.125 to 0.15 mm.
  • Reflow — Refer to solder paste supplier recommendation and optimized per board size and density.
  • See Design Summary LMZ1xxx and LMZ2xxx Power Modules Family application note for reflow information.
  • Maximum number of reflows allowed is one.
LMZ22005 Sample Reflow Profile Figure 7-11 Sample Reflow Profile
Table 7-2 Sample Reflow Profile Table
PROBE MAX TEMP (°C) REACHED MAX TEMP TIME ABOVE 235°C REACHED 235°C TIME ABOVE 245°C REACHED 245°C TIME ABOVE 260°C REACHED 260°C
1 242.5 6.58 0.49 6.39 0.00 – 0.00 –
2 242.5 7.10 0.55 6.31 0.00 7.10 0.00 –
3 241.0 7.09 0.42 6.44 0.00 – 0.00 –