SNVSCQ2A March   2025  – August 2025 LP5817

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Dimming
      2. 7.3.2 PWM Dimming
      3. 7.3.3 Sloper
      4. 7.3.4 Protections
        1. 7.3.4.1 UVLO
        2. 7.3.4.2 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Initialization Mode
      2. 7.4.2 Standby and Normal Mode
      3. 7.4.3 Shutdown Mode
      4. 7.4.4 Thermal Shutdown Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Data Tansactions
      2. 7.5.2 I2C Data Format
      3. 7.5.3 Command Description
    6. 7.6 Register Maps
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Parameters
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Program Procedure
        2. 8.2.3.2 Programming Example
      4. 8.2.4 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LP5817 UNIT
DRL (SOT583)
8 PINS
RθJA Junction-to-ambient thermal resistance 118.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 47.1 °C/W
RθJB Junction-to-board thermal resistance 27.5 °C/W
ΨJT Junction-to-top characterization parameter 1.4 °C/W
ΨJB Junction-to-board characterization parameter 27.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.