SNVU863 july   2023

 

  1.   1
  2.   Description
  3.   3
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1.     General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
    2. 2.1 Test Points
      1. 2.1.1 Key Connections
        1. 2.1.1.1 Connect a Supply to J3 Connector
        2. 2.1.1.2 PWM Input
        3. 2.1.1.3 J1 Connector: Power Supply
    3. 2.2 Power-Up Procedure
      1. 2.2.1 Step 1: Driver Bias Supply
      2. 2.2.2 Step 2: Input Supply
      3. 2.2.3 Step 3: Measure SW Voltage
      4. 2.2.4 Setting Dead-Time
    4. 2.3 Power-Down Procedure
    5. 2.4 Assembly Guidelines
  9. 3Implementation Results
    1. 3.1 Electrical Performance Specifications
      1. 3.1.1 Evaluation Setup
      2. 3.1.2 Performance Data and Results
  10. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials
  11. 5Additional Information
    1. 5.1 Trademarks

2.4 Assembly Guidelines

Please follow the recommended assembly guidelines for the LMG2100 samples:

  • Use low temperature solder paste (like Sn42-Bi58) whose melting temperature is around 130℃-140℃.
  • Soldering using bottom side heating:
    • Recommended for thinner board (less than or equal to four layers) with no components directly underneath the device.
    • Place the solder paste as per the stencil recommendation given in the data sheet.
    • Board held on a pedestal at around 2-3 cm from the top of the hot air blower and device is aligned to keep on the footprint.
  • Soldering using top side heating:
    • This method is recommended for thicker board (more than 4 layers).
    • Use hot air gun (with temperature set to 400℃) and blow the air around the device avoiding directly above the device (temperature can be higher but used for shorter duration).
  • Look for proper soldering connection of signal pins. If there are excess solder, then please remove them manually using solder iron.
  • Avoid putting excess solder paste especially near the edge of PGND pad (pin number 6).
  • If the assembly is done through automatic reflow oven, then set the temperature to less than 180℃.