SNVU863 july 2023
This section describes the EVM hardware and outlines the procedure to set up for evaluation. Figure 4-1 and Figure 4-2 show the top and bottom views of the LMG21EVM-078, respectively.
The EVM can be mounted with a heat sink (S05MZZ37, 20 mm x 35 mm x 10 mm) to improve the thermal performance. The two exposed thermal pads have a high-voltage potential difference between them, therefore an electrically isolated thermal interface material (TIM) is used. TIM of GR80A-0H-50GY (thermal conductivity of 8 W/mK and thickness of 0.5 mm) has been placed between the device and the heat sink.