SNVU947A
October 2025 – April 2026
1
Description
Get Started
Features
Applications
6
1
Evaluation Module Overview
1.1
Introduction
1.2
Kit Contents
1.3
Specifications
1.4
Device Information
1.4.1
Application Circuit Diagrams
2
Hardware
2.1
Test Setup and Procedure
2.1.1
EVM Connections
2.1.2
Test Equipment
2.1.3
Recommended Test Setup
2.1.3.1
Input Connections
2.1.3.2
Output Connections
2.1.4
Test Procedure
2.1.4.1
Line and Load Regulation, Efficiency
3
Implementation Results
3.1
Test Data and Performance Curves
3.1.1
Efficiency
3.1.2
Operating Waveforms
3.1.3
Thermal Performance
4
Hardware Design Files
4.1
Schematic
4.2
PCB Layout
4.2.1
Component Drawings
4.2.2
Layout Guidelines
4.2.2.1
Power Stage Layout
4.2.2.2
Small-signal Component Layout
4.2.2.3
Thermal Design and Layout
4.2.2.4
Ground Plane Design
4.3
Bill of Materials
5
Compliance Information
5.1
Compliance and Certifications
6
Additional Information
6.1
Trademarks
7
Device and Documentation Support
7.1
Device Support
7.1.1
Development Support
7.2
Documentation Support
7.2.1
Related Documentation
7.2.1.1
Low-EMI Design Resources
7.2.1.2
Thermal Design Resources
7.2.1.3
PCB Layout Resources
8
Revision History
7.2.1.2
Thermal Design Resources
Texas Instruments,
Improving Thermal Performance in High Ambient Temperature Environments With Thermally Enhanced Packaging
white paper
Applications notes:
Texas Instruments,
Thermal Design by Insight, Not Hindsight
Texas Instruments,
A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
Texas Instruments,
Semiconductor and IC Package Thermal Metrics
Texas Instruments,
PowerPAD™
Thermally Enhanced Package
Texas Instruments,
Using New Thermal Metrics
Texas Instruments,
PowerPAD™ Made Easy
application brief