SPRADB3 October   2023 AM2631 , AM2631-Q1 , AM2632 , AM2632-Q1 , AM2634 , AM2634-Q1 , AM263P4 , AM263P4-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Feature Differences Between AM263 and AM263P
  5. 2Feature Differences for System Consideration
    1. 2.1 New Features in AM263P
      1. 2.1.1 Resolver Peripheral
        1. 2.1.1.1 Migration From Software to Hardware Resolver
      2. 2.1.2 Trigonometric Math Unit
      3. 2.1.3 Remote L2 Cache
    2. 2.2 Memory Subsystem Differences
    3. 2.3 CONTROLSS Module Differences
      1. 2.3.1 ADC Feature Differences and Additions
      2. 2.3.2 ADC Safety Tile Additions
      3. 2.3.3 ADC_R Module Addition
    4. 2.4 QSPI/OSPI Module Differences
    5. 2.5 Hardware Security Module Differences
    6. 2.6 Hardware Differences
      1. 2.6.1 Sourcing VPP With ANALDO
  6. 3Software Changes Between AM263 and AM263P SDK
  7. 4List of Errata Fixes in AM263P

2.2 Memory Subsystem Differences

AM263P comes with three changes to the memory module. The first is an increase in available Tightly-Coupled Memory (TCM) from 64kB to 256kB. The second is an increase in total on-chip RAM (SRAM) from 2MB to 3MB.

The final change is the addition of a Remote L2 (RL2) cache for external memory, programmable up to 128kB per CPU core. This RL2 cache allows users to cache the system flash into the SoC memory system. For full details on this feature, see the Remote L2 Cache subchapter of the AM263P Technical Reference Manual.