SPRSP96B March   2024  – March 2026 TDA4AEN-Q1 , TDA4VEN-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      10
      2.      11
    3. 5.3 Signal Descriptions
      1.      13
      2. 5.3.1  CPSW3G
        1. 5.3.1.1 MAIN Domain
          1.        16
          2.        17
          3.        18
          4.        19
      3. 5.3.2  CPTS
        1. 5.3.2.1 MAIN Domain
          1.        22
      4. 5.3.3  CSI-2
        1. 5.3.3.1 MAIN Domain
          1.        25
          2.        26
          3.        27
          4.        28
      5. 5.3.4  DDRSS
        1. 5.3.4.1 MAIN Domain
          1.        31
      6. 5.3.5  DSI
        1. 5.3.5.1 MAIN Domain
          1.        34
      7. 5.3.6  DSS
        1. 5.3.6.1 MAIN Domain
          1.        37
      8. 5.3.7  ECAP
        1. 5.3.7.1 MAIN Domain
          1.        40
          2.        41
          3.        42
      9. 5.3.8  Emulation and Debug
        1. 5.3.8.1 MAIN Domain
          1.        45
        2. 5.3.8.2 MCU Domain
          1.        47
      10. 5.3.9  EPWM
        1. 5.3.9.1 MAIN Domain
          1.        50
          2.        51
          3.        52
          4.        53
      11. 5.3.10 EQEP
        1. 5.3.10.1 MAIN Domain
          1.        56
          2.        57
          3.        58
      12. 5.3.11 GPIO
        1. 5.3.11.1 MAIN Domain
          1.        61
          2.        62
        2. 5.3.11.2 MCU Domain
          1.        64
      13. 5.3.12 GPMC
        1. 5.3.12.1 MAIN Domain
          1.        67
      14. 5.3.13 I2C
        1. 5.3.13.1 MAIN Domain
          1.        70
          2.        71
          3.        72
          4.        73
          5.        74
        2. 5.3.13.2 MCU Domain
          1.        76
        3. 5.3.13.3 WKUP Domain
          1.        78
      15. 5.3.14 MCAN
        1. 5.3.14.1 MAIN Domain
          1.        81
          2.        82
        2. 5.3.14.2 MCU Domain
          1.        84
          2.        85
      16. 5.3.15 MCASP
        1. 5.3.15.1 MAIN Domain
          1.        88
          2.        89
          3.        90
          4.        91
          5.        92
      17. 5.3.16 MCSPI
        1. 5.3.16.1 MAIN Domain
          1.        95
          2.        96
          3.        97
        2. 5.3.16.2 MCU Domain
          1.        99
          2.        100
      18. 5.3.17 MDIO
        1. 5.3.17.1 MAIN Domain
          1.        103
      19. 5.3.18 MMC
        1. 5.3.18.1 MAIN Domain
          1.        106
          2.        107
          3.        108
      20. 5.3.19 OLDI
        1. 5.3.19.1 MAIN Domain
          1.        111
      21. 5.3.20 OSPI
        1. 5.3.20.1 MAIN Domain
          1.        114
      22. 5.3.21 Power Supply
        1.       116
      23. 5.3.22 Reserved
        1.       118
      24. 5.3.23 SERDES
        1. 5.3.23.1 MAIN Domain
          1.        121
          2.        122
          3.        123
      25. 5.3.24 System and Miscellaneous
        1. 5.3.24.1 Boot Mode Configuration
          1. 5.3.24.1.1 MAIN Domain
            1.         127
        2. 5.3.24.2 Clock
          1. 5.3.24.2.1 MCU Domain
            1.         130
          2. 5.3.24.2.2 WKUP Domain
            1.         132
        3. 5.3.24.3 System
          1. 5.3.24.3.1 MAIN Domain
            1.         135
          2. 5.3.24.3.2 MCU Domain
            1.         137
          3. 5.3.24.3.3 WKUP Domain
            1.         139
        4. 5.3.24.4 VMON
          1.        141
      26. 5.3.25 TIMER
        1. 5.3.25.1 MAIN Domain
          1.        144
        2. 5.3.25.2 MCU Domain
          1.        146
        3. 5.3.25.3 WKUP Domain
          1.        148
      27. 5.3.26 UART
        1. 5.3.26.1 MAIN Domain
          1.        151
          2.        152
          3.        153
          4.        154
          5.        155
          6.        156
          7.        157
        2. 5.3.26.2 MCU Domain
          1.        159
        3. 5.3.26.3 WKUP Domain
          1.        161
      28. 5.3.27 USB
        1. 5.3.27.1 MAIN Domain
          1.        164
          2.        165
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings for AEC - Q100 Qualified Devices in the AMW Package
    3. 6.3  Power-On Hours (POH)
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Power Consumption Summary
    7. 6.7  Electrical Characteristics
      1. 6.7.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.7.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.7.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.7.4  Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
      5. 6.7.5  eMMCPHY Electrical Characteristics
      6. 6.7.6  SDIO Electrical Characteristics
      7. 6.7.7  LVCMOS Electrical Characteristics
      8. 6.7.8  OLDI LVDS (OLDI) Electrical Characteristics
      9. 6.7.9  CSI-2 (D-PHY) Electrical Characteristics
      10. 6.7.10 DSI (D-PHY) Electrical Characteristics
      11. 6.7.11 USB2PHY Electrical Characteristics
      12. 6.7.12 SerDes PHY Electrical Characteristics
      13. 6.7.13 DDR Electrical Characteristics
    8. 6.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.8.2 Hardware Requirements
      3. 6.8.3 Programming Sequence
      4. 6.8.4 Impact to Your Hardware Warranty
    9. 6.9  Thermal Resistance Characteristics
      1. 6.9.1 Thermal Resistance Characteristics for AMW Package
    10. 6.10 Temperature Sensor Characteristics
    11. 6.11 Timing and Switching Characteristics
      1. 6.11.1 Timing Parameters and Information
      2. 6.11.2 Power Supply Requirements
        1. 6.11.2.1 Power Supply Slew Rate Requirement
        2. 6.11.2.2 Power Supply Sequencing
          1. 6.11.2.2.1 Power-Up Sequencing
          2. 6.11.2.2.2 Power-Down Sequencing
          3. 6.11.2.2.3 Partial IO Power Sequencing
      3. 6.11.3 System Timing
        1. 6.11.3.1 Reset Timing
        2. 6.11.3.2 Error Signal Timing
        3. 6.11.3.3 Clock Timing
      4. 6.11.4 Clock Specifications
        1. 6.11.4.1 Input Clocks / Oscillators
          1. 6.11.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.11.4.1.1.1 Load Capacitance
            2. 6.11.4.1.1.2 Shunt Capacitance
          2. 6.11.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
          3. 6.11.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
          4. 6.11.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 6.11.4.1.5 WKUP_LFOSC0 Not Used
        2. 6.11.4.2 Output Clocks
        3. 6.11.4.3 PLLs
        4. 6.11.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.11.5 Peripherals
        1. 6.11.5.1  ATL
          1. 6.11.5.1.1 ATL_PCLK Timing Requirements
          2. 6.11.5.1.2 ATL_AWS[x] Timing Requirements
          3. 6.11.5.1.3 ATL_BWS[x] Timing Requirements
          4. 6.11.5.1.4 ATCLK[x] Switching Characteristics
        2. 6.11.5.2  CPSW3G
          1. 6.11.5.2.1 CPSW3G MDIO Timing
          2. 6.11.5.2.2 CPSW3G RMII Timing
          3. 6.11.5.2.3 CPSW3G RGMII Timing
        3. 6.11.5.3  CPTS
        4. 6.11.5.4  CSI-2
        5. 6.11.5.5  CSI-2 TX
        6. 6.11.5.6  DDRSS
        7. 6.11.5.7  DSI
        8. 6.11.5.8  DSS
        9. 6.11.5.9  ECAP
        10. 6.11.5.10 Emulation and Debug
          1. 6.11.5.10.1 Trace
          2. 6.11.5.10.2 JTAG
        11. 6.11.5.11 EPWM
        12. 6.11.5.12 EQEP
        13. 6.11.5.13 GPIO
        14. 6.11.5.14 GPMC
          1. 6.11.5.14.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.11.5.14.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.11.5.14.3 GPMC and NAND Flash — Asynchronous Mode
        15. 6.11.5.15 I2C
        16. 6.11.5.16 MCAN
        17. 6.11.5.17 MCASP
        18. 6.11.5.18 MCSPI
          1. 6.11.5.18.1 MCSPI — Controller Mode
          2. 6.11.5.18.2 MCSPI — Peripheral Mode
        19. 6.11.5.19 MMCSD
          1. 6.11.5.19.1 MMC0 - eMMC Interface
            1. 6.11.5.19.1.1  Legacy SDR Mode
            2. 6.11.5.19.1.2  High Speed SDR Mode
            3. 6.11.5.19.1.3  High Speed DDR Mode
            4. 6.11.5.19.1.4  HS200 Mode
            5. 6.11.5.19.1.5  HS400 Mode
            6. 6.11.5.19.1.6  UHS–I SDR12 Mode
            7. 6.11.5.19.1.7  UHS–I SDR25 Mode
            8. 6.11.5.19.1.8  UHS–I SDR50 Mode
            9. 6.11.5.19.1.9  UHS–I DDR50 Mode
            10. 6.11.5.19.1.10 UHS–I SDR104 Mode
          2. 6.11.5.19.2 MMC1/MMC2 - SD/SDIO Interface
            1. 6.11.5.19.2.1 Default Speed Mode
            2. 6.11.5.19.2.2 High Speed Mode
            3. 6.11.5.19.2.3 UHS–I SDR12 Mode
            4. 6.11.5.19.2.4 UHS–I SDR25 Mode
            5. 6.11.5.19.2.5 UHS–I SDR50 Mode
            6. 6.11.5.19.2.6 UHS–I DDR50 Mode
            7. 6.11.5.19.2.7 UHS–I SDR104 Mode
        20. 6.11.5.20 OLDI
          1. 6.11.5.20.1 OLDI0 Switching Characteristics
        21. 6.11.5.21 OSPI
          1. 6.11.5.21.1 OSPI0 PHY Mode
            1. 6.11.5.21.1.1 OSPI0 With PHY Data Training
            2. 6.11.5.21.1.2 OSPI0 Without Data Training
              1. 6.11.5.21.1.2.1 OSPI0 PHY SDR Timing
              2. 6.11.5.21.1.2.2 OSPI0 PHY DDR Timing
          2. 6.11.5.21.2 OSPI0 Tap Mode
            1. 6.11.5.21.2.1 OSPI0 Tap SDR Timing
            2. 6.11.5.21.2.2 OSPI0 Tap DDR Timing
        22. 6.11.5.22 PCIe
        23. 6.11.5.23 Timers
        24. 6.11.5.24 UART
        25. 6.11.5.25 USB
  8. 7 Detailed Description
    1. 7.1 Overview
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Supply Designs
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 LPDDR4 Board Design and Layout Guidelines
      2. 8.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal SPI devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines
      5. 8.2.5 High Speed Differential Signal Routing Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

5.4 Pin Connectivity Requirements

This section describes connectivity requirements for package balls that have specific connectivity requirements and unused package balls.

Note:

All power pins must be supplied with the voltages specified in Recommended Operating Conditions, unless otherwise specified.

Note:

For additional clarification, "leave unconnected" or "no connect" (NC) means no signal traces can be connected to these device ball numbers.

Table 5-83 Connectivity Requirements
AMW
BALL
NUMBER		 BALL NAME CONNECTION REQUIREMENTS
B7
B10		 MCU_ERRORn
TRSTn		 Each of these balls must be connected to VSS through separate external pull resistors to ensure these balls are held to a valid logic-low level if a PCB signal trace is connected and not actively driven by an attached device. The internal pull-down can be used to hold a valid logic-low level if no PCB signal trace is connected to the ball.
A11
E12
F11		 TCK
TDI
TMS		 Each of these balls must be connected to the corresponding power supply(1) through separate external pull resistors to ensure the inputs associated with these balls are held to a valid logic-high level if a PCB signal trace is connected and not actively driven by an attached device. The internal pull-up can be used to hold a valid logic-high level if no PCB signal trace is connected to the ball.
C9
F9
D10
E26
E8
B23
B13
E11
B9
D11
F1
J1
U1
T1		 EMU0
EMU1
MCU_RESETz
RESET_REQz
MCU_PORz
EXTINTN
MCU_I2C0_SCL
MCU_I2C0_SDA
WKUP_I2C0_SCL
WKUP_I2C0_SDA
DDR0_DQS0_n
DDR0_DQS1_n
DDR0_DQS2_n
DDR0_DQS3_n		 Each of these balls must be connected to the corresponding power supply(1) through separate external pull resistors to ensure the inputs associated with these balls are held to a valid logic-high level, if unused.
R22
R23
R26
T27
T25
T24
T21
T22
U27
U26
V27
V25
V26
V24
V22
V23		 GPMC0_AD0
GPMC0_AD1
GPMC0_AD2
GPMC0_AD3
GPMC0_AD4
GPMC0_AD5
GPMC0_AD6
GPMC0_AD7
GPMC0_AD8
GPMC0_AD9
GPMC0_AD10
GPMC0_AD11
GPMC0_AD12
GPMC0_AD13
GPMC0_AD14
GPMC0_AD15		 Each of these balls must be connected to the corresponding power supply(1) or VSS through separate external pull resistors to ensure the inputs associated with these balls are held to a valid logic-high or logic-low level as appropriate to select the desired device boot mode.
AB1
D1
L7
L8
N7
N8
T7
T8		 VDDS_DDR
VDDS_DDR
VDDS_DDR
VDDS_DDR
VDDS_DDR
VDDS_DDR
VDDS_DDR
VDDS_DDR
VDDS_DDR_C		 If DDRSS is not used, each of these balls must be connected directly to VSS.
E1
H1
T1
W1
M4
M3
L4
L6
M5
L3
N2
L2
R6
P1
N1
P2
P6
P4
P3
G2
H6
U4
AA2
D6
D2
F6
D3
G4
E2
G6
F3
H5
H2
K2
L1
J6
J4
J2
H3
V3
R2
R5
T2
R3
U2
U5
V2
Y2
W4
V5
W2
V6
W3
AA3
AA5
U6		 DDR0_DQS0
DDR0_DQS1
DDR0_DQS2
DDR0_DQS3
DDR0_CAS_n
DDR0_RAS_n
DDR0_A0
DDR0_A1
DDR0_A2
DDR0_A3
DDR0_A4
DDR0_A5
DDR0_CAL0
DDR0_CK0
DDR0_CK0_n
DDR0_CKE0
DDR0_CKE1
DDR0_CS0_n
DDR0_CS1_n
DDR0_DM0
DDR0_DM1
DDR0_DM2
DDR0_DM3
DDR0_DQ0
DDR0_DQ1
DDR0_DQ2
DDR0_DQ3
DDR0_DQ4
DDR0_DQ5
DDR0_DQ6
DDR0_DQ7
DDR0_DQ8
DDR0_DQ9
DDR0_DQ10
DDR0_DQ11
DDR0_DQ12
DDR0_DQ13
DDR0_DQ14
DDR0_DQ15
DDR0_DQ16
DDR0_DQ17
DDR0_DQ18
DDR0_DQ19
DDR0_DQ20
DDR0_DQ21
DDR0_DQ22
DDR0_DQ23
DDR0_DQ24
DDR0_DQ25
DDR0_DQ26
DDR0_DQ27
DDR0_DQ28
DDR0_DQ29
DDR0_DQ30
DDR0_DQ31
DDR0_RESET0_n		 If DDRSS is not used, leave unconnected.Note: The DDR0 pins in this list can only be left unconnected when VDDS_DDR and VDDS_DDR_C are connected to VSS. The DDR0 pins must be connected as defined in the DDR Board Design and Layout Guidelines, when VDDS_DDR and VDDS_DDR_C are connected to a power source.
Y9 VDDS_MMC0 If MMC0 is not used, each of these balls must be connected to any 1.8V power source that does not violate device power supply sequencing requirements.
E15
F14
AB8
AA10
AB14
AB15
AA16
AA8
E18
AB5
AA6
W7
E17
D17
F18 		SERDES0_REXT
SERDES1_REXT
CSI0_RXRCALIB
CSI1_RXRCALIB
CSI2_RXRCALIB
CSI3_RXRCALIB
DSI0_TXRCALIB
USB0_RCALIB
USB1_RCALIB
USB0_DM
USB0_DP
USB0_VBUS
USB1_DM
USB1_DP
USB1_VBUS 		Each of these balls must be connected to VSS through an appropriate external pull resistor to ensure these balls are held to a valid logic-low level, if unused. Refer to Signal Descriptions footnote for appropriate value of pull resistor for each signal.
G9
AC1
AE1
AE2
AD1
AD3
AD2
AB4
AC2
AC3
AB3
AF1
AB2 		VPP
MMC0_CALPAD
MMC0_CLK
MMC0_CMD
MMC0_DS
MMC0_DAT0
MMC0_DAT1
MMC0_DAT2
MMC0_DAT3
MMC0_DAT4
MMC0_DAT5
MMC0_DAT6
MMC0_DAT7 		Each of these balls must be left unconnected, if unused.
W15
Y15
W13
W16
Y13 		VDDA_CORE_CSI_DSI
VDDA_CORE_CSI_DSI
VDDA_1P8_CSI_DSI
VDDA_1P8_CSI_DSI
VDDA_1P8_CSI_DSI 		If CSIRX0 and DSITX0 are not used and the device boundary scan function is required, each of these balls must be connected to valid power sources.If CSIRX0 and DSITX0 are not used and the device boundary scan function is not required, each of these balls can alternatively be connected directly to VSS.
AC7
AC6
AD6
AD5 		CSI0_RXCLKN
CSI0_RXCLKP
CSI0_RXN0
CSI0_RXP0 		If CSIRX0 is not used, leave unconnected.
AE5
AE4		 CSI0_RXN1
CSI0_RXP1		 If CSIRX0 is not used or only operated in 1-lane mode, leave unconnected.
AF4
AF3		 CSI0_RXN2
CSI0_RXP2		 If CSIRX0 is not used or only operated in 1-lane or 2-lane mode, leave unconnected.
AG3
AG2		 CSI0_RXN3
CSI0_RXP3		 If CSIRX0 is not used or only operated in 1-lane, 2-lane, or 3-lane mode, leave unconnected.
AE16
AE17
AD17
AD18 		DSI0_TXCLKN
DSI0_TXCLKP
DSI0_TXN0
DSI0_TXP0 		If DSITX0 is not used, leave unconnected.
AF15
AF16		 DSI0_TXN1
DSI0_TXP1		 If DSITX0 is not used or only operated in 1-lane mode, leave unconnected.
AG14
AG15		 DSI0_TXN2
DSI0_TXP2		 If DSITX0 is not used or only operated in 1-lane or 2-lane mode, leave unconnected.
AC18
AC19		 DSI0_TXN3
DSI0_TXP3		 If DSITX0 is not used or only operated in 1-lane, 2-lane, or 3-lane mode, leave unconnected.
AF23
AG24
AG22
AG23
AB20
AB21
AG20
AG21
AD21
AC21
AF19
AF18
AG17
AG18
AB19
AA20
AF21
AE20
AD20
AE19 		OLDI0_A0N
OLDI0_A0P
OLDI0_A1N
OLDI0_A1P
OLDI0_A2N
OLDI0_A2P
OLDI0_A3N
OLDI0_A3P
OLDI0_A4N
OLDI0_A4P
OLDI0_A5N
OLDI0_A5P
OLDI0_A6N
OLDI0_A6P
OLDI0_A7N
OLDI0_A7P
OLDI0_CLK0N
OLDI0_CLK0P
OLDI0_CLK1N
OLDI0_CLK1P 		If OLDI0 is not used, leave unconnected.
G7
J7
K7
A3		 VMON_ER_VSYS
VMON_1P8_SOC
VMON_3P3_SOC
WKUP_LFOSC0_XI		 Each of these balls must be connected to VSS through separate external pull resistors to ensure these balls are held to a valid logic-low level, if unused.
(1) To determine which power supply is associated with any IO, see the POWER column of the Pin Attributes table.

Note:

All other unused signal balls with a Pad Configuration Register can be left unconnected with their multiplexing mode set to GPIO input and internal pull-down resistor enabled. Unused balls are defined as those which only connect to a PCB solder pad. This is the only use case where internal pull resistors are allowed as the only source/sink to hold a valid logic level. Any balls connected to a via, test point, or PCB trace are consider used and must not depend on the internal pull resistor to hold a valid logic level.

Internal pull resistors are weak and may not source enough current to maintain a valid logic level for some operating conditions. This can be the case when connected to components with leakage to the opposite logic level, or when external noise sources couple to signal traces attached to balls which are only pulled to a valid logic level by the internal resistor. Therefore, external pull resistors are recommended to hold a valid logic level on balls with external connections.

Many of the device IOs are turned off by default and external pull resistors may be required to hold inputs of any attached device in a valid logic state until software initializes the respective IOs. The state of configurable device IOs are defined in the BALL STATE DURING RESET RX/TX/PULL and BALL STATE AFTER RESET RX/TX/PULL columns of the Pin Attributes table. Any IO with its input buffer (RX) turned off is allowed to float without damaging the device. However, any IO with its input buffer (RX) turned on shall never be allowed to float to any potential between VILSS and VIHSS. The input buffer can enter a high-current state which could damage the IO cell if allowed to float between these levels.