SPRSP96B March   2024  – March 2026 TDA4AEN-Q1 , TDA4VEN-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      10
      2.      11
    3. 5.3 Signal Descriptions
      1.      13
      2. 5.3.1  CPSW3G
        1. 5.3.1.1 MAIN Domain
          1.        16
          2.        17
          3.        18
          4.        19
      3. 5.3.2  CPTS
        1. 5.3.2.1 MAIN Domain
          1.        22
      4. 5.3.3  CSI-2
        1. 5.3.3.1 MAIN Domain
          1.        25
          2.        26
          3.        27
          4.        28
      5. 5.3.4  DDRSS
        1. 5.3.4.1 MAIN Domain
          1.        31
      6. 5.3.5  DSI
        1. 5.3.5.1 MAIN Domain
          1.        34
      7. 5.3.6  DSS
        1. 5.3.6.1 MAIN Domain
          1.        37
      8. 5.3.7  ECAP
        1. 5.3.7.1 MAIN Domain
          1.        40
          2.        41
          3.        42
      9. 5.3.8  Emulation and Debug
        1. 5.3.8.1 MAIN Domain
          1.        45
        2. 5.3.8.2 MCU Domain
          1.        47
      10. 5.3.9  EPWM
        1. 5.3.9.1 MAIN Domain
          1.        50
          2.        51
          3.        52
          4.        53
      11. 5.3.10 EQEP
        1. 5.3.10.1 MAIN Domain
          1.        56
          2.        57
          3.        58
      12. 5.3.11 GPIO
        1. 5.3.11.1 MAIN Domain
          1.        61
          2.        62
        2. 5.3.11.2 MCU Domain
          1.        64
      13. 5.3.12 GPMC
        1. 5.3.12.1 MAIN Domain
          1.        67
      14. 5.3.13 I2C
        1. 5.3.13.1 MAIN Domain
          1.        70
          2.        71
          3.        72
          4.        73
          5.        74
        2. 5.3.13.2 MCU Domain
          1.        76
        3. 5.3.13.3 WKUP Domain
          1.        78
      15. 5.3.14 MCAN
        1. 5.3.14.1 MAIN Domain
          1.        81
          2.        82
        2. 5.3.14.2 MCU Domain
          1.        84
          2.        85
      16. 5.3.15 MCASP
        1. 5.3.15.1 MAIN Domain
          1.        88
          2.        89
          3.        90
          4.        91
          5.        92
      17. 5.3.16 MCSPI
        1. 5.3.16.1 MAIN Domain
          1.        95
          2.        96
          3.        97
        2. 5.3.16.2 MCU Domain
          1.        99
          2.        100
      18. 5.3.17 MDIO
        1. 5.3.17.1 MAIN Domain
          1.        103
      19. 5.3.18 MMC
        1. 5.3.18.1 MAIN Domain
          1.        106
          2.        107
          3.        108
      20. 5.3.19 OLDI
        1. 5.3.19.1 MAIN Domain
          1.        111
      21. 5.3.20 OSPI
        1. 5.3.20.1 MAIN Domain
          1.        114
      22. 5.3.21 Power Supply
        1.       116
      23. 5.3.22 Reserved
        1.       118
      24. 5.3.23 SERDES
        1. 5.3.23.1 MAIN Domain
          1.        121
          2.        122
          3.        123
      25. 5.3.24 System and Miscellaneous
        1. 5.3.24.1 Boot Mode Configuration
          1. 5.3.24.1.1 MAIN Domain
            1.         127
        2. 5.3.24.2 Clock
          1. 5.3.24.2.1 MCU Domain
            1.         130
          2. 5.3.24.2.2 WKUP Domain
            1.         132
        3. 5.3.24.3 System
          1. 5.3.24.3.1 MAIN Domain
            1.         135
          2. 5.3.24.3.2 MCU Domain
            1.         137
          3. 5.3.24.3.3 WKUP Domain
            1.         139
        4. 5.3.24.4 VMON
          1.        141
      26. 5.3.25 TIMER
        1. 5.3.25.1 MAIN Domain
          1.        144
        2. 5.3.25.2 MCU Domain
          1.        146
        3. 5.3.25.3 WKUP Domain
          1.        148
      27. 5.3.26 UART
        1. 5.3.26.1 MAIN Domain
          1.        151
          2.        152
          3.        153
          4.        154
          5.        155
          6.        156
          7.        157
        2. 5.3.26.2 MCU Domain
          1.        159
        3. 5.3.26.3 WKUP Domain
          1.        161
      28. 5.3.27 USB
        1. 5.3.27.1 MAIN Domain
          1.        164
          2.        165
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings for AEC - Q100 Qualified Devices in the AMW Package
    3. 6.3  Power-On Hours (POH)
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Power Consumption Summary
    7. 6.7  Electrical Characteristics
      1. 6.7.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.7.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.7.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.7.4  Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
      5. 6.7.5  eMMCPHY Electrical Characteristics
      6. 6.7.6  SDIO Electrical Characteristics
      7. 6.7.7  LVCMOS Electrical Characteristics
      8. 6.7.8  OLDI LVDS (OLDI) Electrical Characteristics
      9. 6.7.9  CSI-2 (D-PHY) Electrical Characteristics
      10. 6.7.10 DSI (D-PHY) Electrical Characteristics
      11. 6.7.11 USB2PHY Electrical Characteristics
      12. 6.7.12 SerDes PHY Electrical Characteristics
      13. 6.7.13 DDR Electrical Characteristics
    8. 6.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.8.2 Hardware Requirements
      3. 6.8.3 Programming Sequence
      4. 6.8.4 Impact to Your Hardware Warranty
    9. 6.9  Thermal Resistance Characteristics
      1. 6.9.1 Thermal Resistance Characteristics for AMW Package
    10. 6.10 Temperature Sensor Characteristics
    11. 6.11 Timing and Switching Characteristics
      1. 6.11.1 Timing Parameters and Information
      2. 6.11.2 Power Supply Requirements
        1. 6.11.2.1 Power Supply Slew Rate Requirement
        2. 6.11.2.2 Power Supply Sequencing
          1. 6.11.2.2.1 Power-Up Sequencing
          2. 6.11.2.2.2 Power-Down Sequencing
          3. 6.11.2.2.3 Partial IO Power Sequencing
      3. 6.11.3 System Timing
        1. 6.11.3.1 Reset Timing
        2. 6.11.3.2 Error Signal Timing
        3. 6.11.3.3 Clock Timing
      4. 6.11.4 Clock Specifications
        1. 6.11.4.1 Input Clocks / Oscillators
          1. 6.11.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.11.4.1.1.1 Load Capacitance
            2. 6.11.4.1.1.2 Shunt Capacitance
          2. 6.11.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
          3. 6.11.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
          4. 6.11.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 6.11.4.1.5 WKUP_LFOSC0 Not Used
        2. 6.11.4.2 Output Clocks
        3. 6.11.4.3 PLLs
        4. 6.11.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.11.5 Peripherals
        1. 6.11.5.1  ATL
          1. 6.11.5.1.1 ATL_PCLK Timing Requirements
          2. 6.11.5.1.2 ATL_AWS[x] Timing Requirements
          3. 6.11.5.1.3 ATL_BWS[x] Timing Requirements
          4. 6.11.5.1.4 ATCLK[x] Switching Characteristics
        2. 6.11.5.2  CPSW3G
          1. 6.11.5.2.1 CPSW3G MDIO Timing
          2. 6.11.5.2.2 CPSW3G RMII Timing
          3. 6.11.5.2.3 CPSW3G RGMII Timing
        3. 6.11.5.3  CPTS
        4. 6.11.5.4  CSI-2
        5. 6.11.5.5  CSI-2 TX
        6. 6.11.5.6  DDRSS
        7. 6.11.5.7  DSI
        8. 6.11.5.8  DSS
        9. 6.11.5.9  ECAP
        10. 6.11.5.10 Emulation and Debug
          1. 6.11.5.10.1 Trace
          2. 6.11.5.10.2 JTAG
        11. 6.11.5.11 EPWM
        12. 6.11.5.12 EQEP
        13. 6.11.5.13 GPIO
        14. 6.11.5.14 GPMC
          1. 6.11.5.14.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.11.5.14.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.11.5.14.3 GPMC and NAND Flash — Asynchronous Mode
        15. 6.11.5.15 I2C
        16. 6.11.5.16 MCAN
        17. 6.11.5.17 MCASP
        18. 6.11.5.18 MCSPI
          1. 6.11.5.18.1 MCSPI — Controller Mode
          2. 6.11.5.18.2 MCSPI — Peripheral Mode
        19. 6.11.5.19 MMCSD
          1. 6.11.5.19.1 MMC0 - eMMC Interface
            1. 6.11.5.19.1.1  Legacy SDR Mode
            2. 6.11.5.19.1.2  High Speed SDR Mode
            3. 6.11.5.19.1.3  High Speed DDR Mode
            4. 6.11.5.19.1.4  HS200 Mode
            5. 6.11.5.19.1.5  HS400 Mode
            6. 6.11.5.19.1.6  UHS–I SDR12 Mode
            7. 6.11.5.19.1.7  UHS–I SDR25 Mode
            8. 6.11.5.19.1.8  UHS–I SDR50 Mode
            9. 6.11.5.19.1.9  UHS–I DDR50 Mode
            10. 6.11.5.19.1.10 UHS–I SDR104 Mode
          2. 6.11.5.19.2 MMC1/MMC2 - SD/SDIO Interface
            1. 6.11.5.19.2.1 Default Speed Mode
            2. 6.11.5.19.2.2 High Speed Mode
            3. 6.11.5.19.2.3 UHS–I SDR12 Mode
            4. 6.11.5.19.2.4 UHS–I SDR25 Mode
            5. 6.11.5.19.2.5 UHS–I SDR50 Mode
            6. 6.11.5.19.2.6 UHS–I DDR50 Mode
            7. 6.11.5.19.2.7 UHS–I SDR104 Mode
        20. 6.11.5.20 OLDI
          1. 6.11.5.20.1 OLDI0 Switching Characteristics
        21. 6.11.5.21 OSPI
          1. 6.11.5.21.1 OSPI0 PHY Mode
            1. 6.11.5.21.1.1 OSPI0 With PHY Data Training
            2. 6.11.5.21.1.2 OSPI0 Without Data Training
              1. 6.11.5.21.1.2.1 OSPI0 PHY SDR Timing
              2. 6.11.5.21.1.2.2 OSPI0 PHY DDR Timing
          2. 6.11.5.21.2 OSPI0 Tap Mode
            1. 6.11.5.21.2.1 OSPI0 Tap SDR Timing
            2. 6.11.5.21.2.2 OSPI0 Tap DDR Timing
        22. 6.11.5.22 PCIe
        23. 6.11.5.23 Timers
        24. 6.11.5.24 UART
        25. 6.11.5.25 USB
  8. 7 Detailed Description
    1. 7.1 Overview
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Supply Designs
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 LPDDR4 Board Design and Layout Guidelines
      2. 8.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal SPI devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines
      5. 8.2.5 High Speed Differential Signal Routing Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

6.11.5.19.1.4 HS200 Mode

Table 6-91, Figure 6-74, Table 6-92, and Figure 6-75 present both timing requirements and switching characteristics for MMC0 – HS200 Mode.

Table 6-91 MMC0 Timing Requirements – HS200 Mode see Figure 6-74
NO. MIN MAX UNIT
HS2004 tDVW Input data valid window, MMC0_CMD and MMC0_DAT[7:0] 2.0(1) ns
(1) This parameter defines the minimum data valid window required by the host, where any data valid window presented to the host greater than this value ensures the host is able to capture valid data. The value defined by this parameter is smaller than the smallest possible data valid window defined for any eMMC device operating in HS200 mode.
TDA4VEN-Q1 TDA4AEN-Q1 MMC0 – HS200 – Receive Mode Figure 6-74 MMC0 – HS200 – Receive Mode
Table 6-92 MMC0 Switching Characteristics – HS200 Mode see Figure 6-75
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMC0_CLK 200 MHz
HS2005 tc(clk) Cycle time, MMC0_CLK 5 ns
HS2006 tw(clkH) Pulse duration, MMC0_CLK high 2.12 ns
HS2007 tw(clkL) Pulse duration, MMC0_CLK low 2.12 ns
HS2008 td(clkL-cmdV) Delay time, MMC0_CLK rising edge to MMC0_CMD transition 1.07 3.21 ns
HS2009 td(clkL-dV) Delay time, MMC0_CLK rising edge to MMC0_DAT[7:0] transition 1.07 3.21 ns
TDA4VEN-Q1 TDA4AEN-Q1 MMC0 – HS200 Mode – Transmit Mode Figure 6-75 MMC0 – HS200 Mode – Transmit Mode