SPRUJH0B April   2025  – September 2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
      1. 1.3.1 External Power Supply or Accessory Requirements
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Hardware Description
      1. 2.1.1 Functional Description and Connections
        1. 2.1.1.1 Power Domains
        2. 2.1.1.2 LEDs
        3. 2.1.1.3 Encoder Connectors
        4. 2.1.1.4 Boot Modes
        5. 2.1.1.5 BoosterPack Sites
        6. 2.1.1.6 Analog Voltage Reference
        7. 2.1.1.7 Other Headers and Jumpers
          1. 2.1.1.7.1 USB Isolation Block
          2. 2.1.1.7.2 Alternate Power
          3. 2.1.1.7.3 5V Step-up Converter
        8. 2.1.1.8 Programmable Gain Amplifier (PGA)
      2. 2.1.2 Debug Interface
        1. 2.1.2.1 XDS110 Debug Probe
        2. 2.1.2.2 Virtual COM Port
      3. 2.1.3 Alternate Routing
        1. 2.1.3.1 Overview
        2. 2.1.3.2 GPIO35/GPIO37 Routing
        3. 2.1.3.3 eQEP Routing
        4. 2.1.3.4 X1, X2 Routing
        5. 2.1.3.5 PWM DAC
    2. 2.2 Using the F28E12x LaunchPad
    3. 2.3 BoosterPacks
    4. 2.4 Hardware Revisions
      1. 2.4.1 Revision A
      2. 2.4.2 Revision E2
  9. 3Software
    1. 3.1 Software Development
      1. 3.1.1 Software Tools and Packages
      2. 3.1.2 F28E12x LaunchPad Demo Program
      3. 3.1.3 Programming and Running Other Software on the F28E12x LaunchPad
  10. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
      1. 4.2.1 LAUNCHXL-F28E12X Board Dimensions
    3. 4.3 Bill of Materials (BOM)
  11. 5Additional Information
    1. 5.1 Frequently Asked Questions
    2. 5.2 Trademarks
  12. 6References
    1. 6.1 Reference Documents
    2. 6.2 Other TI Components Used in This Design
  13. 7Revision History

2.4.2 Revision E2

The first production revision of the LAUNCHXL-F28E12x was released in April 2025. This revision can be identified by the "MCU152E2" silkscreen labeling on the back side of the EVM between the BoosterPack Connector.

Issues and concerns that have been identified on the EVM are listed below:

Known issues:

  • No issues to report at this time of initial release.

Special notes and considerations to be aware of:

  • Nothing to report at this time of initial release.