SPRZ422K August   2014  – May 2024 TMS320F28374S , TMS320F28375S , TMS320F28375S-Q1 , TMS320F28376S , TMS320F28377S , TMS320F28377S-Q1 , TMS320F28378S , TMS320F28379S

 

  1.   1
  2.   Abstract
  3. 1Usage Notes and Advisories Matrices
    1. 1.1 Usage Notes Matrix
    2. 1.2 Advisories Matrix
  4. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device and Development Support Tool Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
  5. 3Silicon Revision C Usage Notes and Advisories
    1. 3.1 Silicon Revision C Usage Notes
      1. 3.1.1 PIE: Spurious Nested Interrupt After Back-to-Back PIEACK Write and Manual CPU Interrupt Mask Clear
      2. 3.1.2 Caution While Using Nested Interrupts
      3. 3.1.3 SYS/BIOS: Version Implemented in Device ROM is not Maintained
      4. 3.1.4 SDFM: Use Caution While Using SDFM Under Noisy Conditions
      5. 3.1.5 McBSP: XRDY Bit can Hold the Not-Ready Status (0) if New Data is Written to the DX1 Register Without Verifying if the XRDY Bit is in its Ready State (1)
    2. 3.2 Silicon Revision C Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
      4.      Advisory
      5.      Advisory
      6.      Advisory
      7.      Advisory
      8.      Advisory
      9.      Advisory
      10.      Advisory
      11.      Advisory
      12.      Advisory
      13.      Advisory
      14.      Advisory
      15.      Advisory
      16.      Advisory
      17.      Advisory
      18.      Advisory
      19.      Advisory
      20.      Advisory
      21.      Advisory
      22.      Advisory
      23.      Advisory
      24.      Advisory
      25.      Advisory
      26.      Advisory
      27.      Advisory
      28.      Advisory
      29.      Advisory
      30.      Advisory
      31.      Advisory
      32.      Advisory
      33.      Advisory
      34.      Advisory
      35.      Advisory
      36.      Advisory
      37.      Advisory
  6. 4Silicon Revision B Usage Notes and Advisories
    1. 4.1 Silicon Revision B Usage Notes
    2. 4.2 Silicon Revision B Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
      4.      Advisory
      5.      Advisory
      6.      Advisory
      7.      Advisory
      8.      Advisory
      9.      Advisory
  7. 5Documentation Support
  8. 6Trademarks
  9. 7Revision History

Advisory

CMPSS: COMPxLATCH May Not Clear Properly Under Certain Conditions

Revisions Affected

B, C

Details

The CMPSS latched path is designed to retain a tripped state within a local latch (COMPxLATCH) until it is cleared by software (via COMPSTSCLR) or by PWMSYNC.

COMPxLATCH is set indirectly by the comparator output after the signal has been digitized and qualified by the Digital Filter. The maximum latency expected for the comparator output to reach COMPxLATCH may be expressed in CMPSS module clock cycles as:

LATENCY = 1 + (1 x FILTER_PRESCALE) + (FILTER_THRESH x FILTER_PRESCALE)

When COMPxLATCH is cleared by software or by PWMSYNC, the latch itself is cleared as desired, but the data path prior to COMPxLATCH may not reflect the comparator output value for an additional LATENCY number of module clock cycles. If the Digital Filter output resolves to a logical 1 when COMPxLATCH is cleared, the latch will be set again on the following clock cycle.

Workarounds

Allow the Digital Filter output to resolve to logical 0 before clearing COMPxLATCH.

If COMPxLATCH is cleared by software, the output state of the Digital Filter can be confirmed through the COMPSTS register prior to clearing the latch. For instances where a large LATENCY value produces intolerable delays, the filter FIFO may be flushed by reinitializing the Digital Filter (via CTRIPxFILCTL).

If COMPxLATCH is cleared by PWMSYNC, the user application should be designed such that the comparator trip condition is cleared at least LATENCY cycles before PWMSYNC is generated.