SWRA797 September   2024 CC1312PSIP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 RF Function and Frequency Range
    2. 1.2 LP-EM-CC1312PSIP
  5. 2Software – Certified PHYs
    1. 2.1 14dBm Tx and Rx Port
      1. 2.1.1 WB-DSSS
      2. 2.1.2 TI 15.4
      3. 2.1.3 PowerG PHY
      4. 2.1.4 mioty PHY
      5. 2.1.5 WiSun PHY
    2. 2.2 20dBm Tx Port
      1. 2.2.1 WB-DSSS PHY
      2. 2.2.2 TI 15.4 PHY
      3. 2.2.3 PowerG PHY
      4. 2.2.4 mioty PHY
      5. 2.2.5 Wi-SUN PHY
  6. 3Hardware
    1. 3.1 Recommended Layout
      1. 3.1.1 4-Layer Design
      2. 3.1.2 2-Layer Design
      3. 3.1.3 GND Vias
      4. 3.1.4 Maximum Track Length
    2. 3.2 Antennas
      1. 3.2.1 Certified Antennas
      2. 3.2.2 Cross-Linking Certified Antennas
    3. 3.3 Reusing of FCC ID and IC
      1. 3.3.1 Documentation Supplied to the TCB
      2. 3.3.2 Permissive Change Policy
        1. 3.3.2.1 Class 1 Permissive Change (C1PC)
        2. 3.3.2.2 Class 2 Permissive Change (C2PC)
        3. 3.3.2.3 Class 3 Permissive Change (C3PC)
      3. 3.3.3 Changes in the FCC ID or IC
      4. 3.3.4 Re-use of FCC ID and IC Certifications Step-by-Step
    4. 3.4 Recommended Production Testing
  7. 4References

1 Introduction

The SimpleLink™ CC1312PSIP [4.1] device is an RF certified System-in-Package (SiP) Sub-1GHz wireless module supporting Wi-SUN®, Wireless M-Bus, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), mioty, proprietary systems, including the TI 15.4-Stack. The CC1312PSIP microcontroller (MCU) is based on an Arm® Cortex® M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, and medical applications.

The CC1312PSIP [4.1] has a low sleep current of 0.9μA with RTC and 80KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1Hz ADC sampling at average 1μA system current.

The CC1312PSIP [4.1] has low soft error rate (SER) failure-in-time (FIT) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply including dual sourcing of key components in the SIP.

The CC1312PSIP [4.1] device is part of the SimpleLink MCU platform, which consists of Wi-Fi™, Bluetooth® Low Energy, Thread, Zigbee™, Wi-SUN, Amazon Sidewalk, mioty, Sub-1GHz MCUs, and host MCUs. CC1312PSIP [4.1] is part of a portfolio that includes pin-compatible 2.4GHz SIPs for easy adaption of a wireless product to multiple communication standards. The common SimpleLink Low Power F2 SDK and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink Academy training sessions are included in the SDK.

By utilizing 3D assembly packaging with the SMD components placed on the CC1312PSIP [4.1] laminate and then placing the chip die directly above, the package volume is fully utilized. For the CC1312PSIP block diagram, see Figure 1-1. The RF filtering section has been was reduced to two singular components from 25 components by making two Integrated Passive Components (IPC). One IPC for the 14dBm Tx / Rx port and another for the 20dBm Tx port. This resulted in a final package size of 7 x 7mm with all components fully integrated.

CC1312PSIP Block Diagram Figure 1-1 CC1312PSIP Block Diagram
Traditional Design With a QFN Chipset Figure 1-2 Traditional Design With a QFN Chipset

With the traditional design shown in Figure 1-2, this has a PCB floor space of approximately 324mm (18 x 18mm); with the CC1312PSIP [4.1] this was reduced to just 49mm (7 x 7mm). That is an 85 % size reduction.

In addition, to the size reduction, fully certified PHYs and FCC / IC modular certification that enables the option just to re-use the certification. There are also new features such as SW-TCXO that provide TCXO accuracy.