SWRS353A April   2025  – February 2026 CC3350MOD , CC3351MOD

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagrams
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Descriptions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Electrical Characteristics
    5. 6.5  WLAN Performance: 2.4GHz Receiver Characteristics
    6. 6.6  WLAN Performance: 2.4GHz Transmitter Power
    7. 6.7  WLAN Performance: 5GHz Receiver Characteristics
    8. 6.8  WLAN Performance: 5GHz Transmitter Power
    9. 6.9  Bluetooth Low Energy Performance: Receiver Characteristics
    10. 6.10 Bluetooth Low Energy Performance: Transmitter Characteristics
    11. 6.11 Current Consumption: 2.4GHz WLAN Static Modes
    12. 6.12 Current Consumption: 5GHz WLAN Static Modes
    13. 6.13 Current Consumption: 2.4GHz WLAN Use Cases
    14. 6.14 Current Consumption: 5GHz WLAN Use Cases
    15. 6.15 Current Consumption: Bluetooth Low Energy Static Modes
    16. 6.16 Current Consumption: Bluetooth Low Energy Use Cases
    17. 6.17 Current Consumption: Device Modes
    18. 6.18 Timing and Switching Characteristics
      1. 6.18.1 Power Supply Sequencing
      2. 6.18.2 Clocking Specifications
        1. 6.18.2.1 Slow Clock Generated Internally
        2. 6.18.2.2 Slow Clock Using an External Oscillator
    19. 6.19 Interface Timing Characteristics
      1. 6.19.1 SDIO Timing Specifications
        1. 6.19.1.1 SDIO Timing Diagram: Default Speed
        2. 6.19.1.2 SDIO Timing Diagram: High Speed
      2. 6.19.2 SPI Timing Specifications
        1. 6.19.2.1 SPI Timing Diagram
        2. 6.19.2.2 SPI Timing Parameters
      3. 6.19.3 UART 4-Wire Interface
        1. 6.19.3.1 UART Timing Parameters
  8. 7 Detailed Description
    1. 7.1 WLAN Features
    2. 7.2 Bluetooth Low Energy Features
  9. 8 Device Certification
    1. 8.1 FCC Certification and Statement
    2. 8.2 IC/ISED Certification and Statement
    3. 8.3 ETSI/CE
    4. 8.4 MIC Certification
    5. 8.5 Manual Information to the End User
    6. 8.6 Module Markings
      1. 8.6.1 Test Grades
  10. 9 Application Information
    1. 9.1 Applications, Implementation, and Layout
    2. 9.2 Typical Application—CC335xMOD Reference Design
    3. 9.3 Design Recommendations
      1. 9.3.1 General Layout Recommendations
      2. 9.3.2 CC335xMOD RF Layout Recommendations
      3. 9.3.3 Thermal Board Recommendations
    4. 9.4 Baking and SMT Recommendations
      1. 9.4.1 Baking Recommendations
      2. 9.4.2 SMT Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Nomenclature Boilerplate
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.4.1 Baking Recommendations

Follow these baking guidelines for the CC335xMOD module:

  • Follow MSL level 4 to perform the baking process.
  • After the bag is open, devices subjected to reflow solder or other high-temperature processes must be mounted within 72 hours of factory conditions (< 30°C/60% RH) or stored at <10% RH.
  • If the humidity indicator card reads >10%, devices require baking before they are mounted.
  • If baking is required, bake devices for 8 hours at 125°C.