SWRU620C April   2024  – May 2026

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1 Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specifications
      1. 1.3.1 Block Diagram
      2. 1.3.2 EVM Mux Block Diagram
    4. 1.4 Device Information
    5. 1.5 IWRL6432AOPEVM Antenna
    6. 1.6 RF Specification
  7. 2 Hardware
    1. 2.1 PCB Material
    2. 2.2 Switches and LEDs
      1. 2.2.1 SOP Configuration
      2. 2.2.2 Switches
    3. 2.3 DC Jack
    4. 2.4 DCA1000 HD Connector
    5. 2.5 CANFD Connector
    6. 2.6 LIN PHY Connection
    7. 2.7 I2C Connections
      1. 2.7.1 EEPROM
      2. 2.7.2 On-Board Sensors
    8. 2.8 XDS110 Interface
    9. 2.9 FTDI Interface
  8. 3 Software
    1. 3.1 Software Description
    2. 3.2 Flashing the Board
    3. 3.3 mmWave Out of Box Demo
      1. 3.3.1 IWRL6432AOP Demo Visualization Getting Started
    4. 3.4 DCA1000EVM Mode
  9. 4 Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
      1. 4.2.1 PCB Storage and Handling Recommendations:
        1. 4.2.1.1 PCB Storage and Handling Recommendations:
        2. 4.2.1.2 Higher Power Demanding Applications
    3. 4.3 Bill of Materials (BOM)
  10. 5 Regulatory Notices
    1. 5.1 Cable Length
    2. 5.2 RF Exposure
  11. 6 Additional Information
    1. 6.1 Trademarks
  12. 7 Related Documentation
  13. 8 TI E2E Community
  14. 9 References
  15. 10Revision History

1.3.1 Block Diagram

Figure 1-1 shows the functional block diagram. The mission board (sensor area) side contains the essential components for the TI radar system namely Crystal Oscillator, Serial FLASH and TI mmWave Radar chip. The expandable area contains the Power Distribution Network, on board XDS110 USB to UART converter, FTDI chip, 60-pin connector for interfacing with the DCA1000EVM.

IWRL6432AOPEVM Block Diagram of the IWRL6432AOPEVM Figure 1-1 Block Diagram of the IWRL6432AOPEVM