SWRU620C April   2024  – May 2026

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1 Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specifications
      1. 1.3.1 Block Diagram
      2. 1.3.2 EVM Mux Block Diagram
    4. 1.4 Device Information
    5. 1.5 IWRL6432AOPEVM Antenna
    6. 1.6 RF Specification
  7. 2 Hardware
    1. 2.1 PCB Material
    2. 2.2 Switches and LEDs
      1. 2.2.1 SOP Configuration
      2. 2.2.2 Switches
    3. 2.3 DC Jack
    4. 2.4 DCA1000 HD Connector
    5. 2.5 CANFD Connector
    6. 2.6 LIN PHY Connection
    7. 2.7 I2C Connections
      1. 2.7.1 EEPROM
      2. 2.7.2 On-Board Sensors
    8. 2.8 XDS110 Interface
    9. 2.9 FTDI Interface
  8. 3 Software
    1. 3.1 Software Description
    2. 3.2 Flashing the Board
    3. 3.3 mmWave Out of Box Demo
      1. 3.3.1 IWRL6432AOP Demo Visualization Getting Started
    4. 3.4 DCA1000EVM Mode
  9. 4 Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
      1. 4.2.1 PCB Storage and Handling Recommendations:
        1. 4.2.1.1 PCB Storage and Handling Recommendations:
        2. 4.2.1.2 Higher Power Demanding Applications
    3. 4.3 Bill of Materials (BOM)
  10. 5 Regulatory Notices
    1. 5.1 Cable Length
    2. 5.2 RF Exposure
  11. 6 Additional Information
    1. 6.1 Trademarks
  12. 7 Related Documentation
  13. 8 TI E2E Community
  14. 9 References
  15. 10Revision History

4.2.1.1 PCB Storage and Handling Recommendations:

To avoid oxidation, the PCB must be stored in an ESD cover and kept at a controlled room temperature with low humidity conditions. All ESD precautions must be taken while using and handling the EVM.