SWRZ107A December   2020  – June 2022 CC2662R-Q1

PRODUCTION DATA  

  1.   Abstract
  2.   Trademarks
  3. 1Advisories Matrix
  4. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device and Development Support-Tool Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
  5. 3Advisories
    1.     Power_03
    2.     PKA_01
    3.     PKA_02
    4.     I2C_01
    5.     I2S_01
    6.     CPU_01
    7.     CPU_02
    8.     CPU_03
    9.     CPU_Sys_01
    10.     Sys_01
    11.     Sys_03
    12.     SYSCTRL_01
    13.     SRAM_01
    14.     GPTM_01
    15.     ADC_01
    16.     ADC_02
    17.     ADC_03
    18.     ADC_04
    19.     ADC_05
  6. 4Revision History

2.3 Package Symbolization and Revision Identification

Figure 2-1 and Table 2-1 describe package symbolization and the device revision code.

Figure 2-1 Package Symbolization for Silicon Revision E
Table 2-1 Revision Identification
DEVICE REVISION CODE SILICON REVISION
E PG2.1 (see following NOTE)
F PG3.0 (see following NOTE)
Note:
  • PG2.1 and PG3.0 are functionally equivalent and share the same data sheet specifications.
  • PG3.0 was introduced to support the release into additional wafer fab sites.