Product details


Frequency 2402-2480 MHz Standard Wireless BMS Operating temperature range (C) -40 to 105 Rating Automotive TI functional safety category Functional Safety Quality-Managed Transmission principle BR, EDR open-in-new Find other Other wireless technologies

Package | Pins | Size

VQFN (RGZ) 48 open-in-new Find other Other wireless technologies


  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C3
  • Functional Safety Quality-Managed
    • Documentation is planned to be available to aid functional safety system design
  • Microcontroller
    • Powerful 48-MHz Arm Cortex-M4F processor
    • EEMBC CoreMark score: 148
    • Clock speed up to 48 MHz
    • 352KB of in-system Programmable Flash
    • 256KB of ROM for protocols and library functions
    • 8KB of cache SRAM
    • 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
    • 2-pin cJTAG and JTAG debugging
    • Supports Over-the-Air upgrade (OTA)
  • RoHS-compliant package
    • 7-mm x 7-mm VQFN48 with wettable flanks
  • Radio section
    • 2.4 GHz RF transceiver compatible with TI wireless BMS protocol
    • Output power up to +5 dBm with temperature compensation
    • Suitable for systems targeting compliance with worldwide radio frequency regulations:
      • EN 300 328 (Europe)
      • EN 300 440 Category 2 (Europe)
      • FCC CFR47 Part 15 (US)
      • ARIB STD-T66 (Japan)
  • Low power
    • Wide supply voltage range: 1.8 V to 3.63 V
    • Active mode RX: 6.9 mA
    • Active mode TX 0 dBm: 7.3 mA
    • Active mode TX 5 dBm: 9.6 mA
    • Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 µA/MHz)
    • Sensor controller, low-power mode, 2 MHz, running infinite loop: 31.9 µA
    • Sensor controller, active mode, 24 MHz, running infinite loop: 808.5 µA
    • Standby: 0.94 µA (RTC on, 80KB RAM and CPU retention)
    • Shutdown: 150 nA (wakeup on external events)
  • Peripherals
    • 31 GPIOs, digital peripherals can be routed to any GPIO
    • 4 × 32-bit or 8 × 16-bit general-purpose timers
    • 12-bit ADC, 200 kSamples/s, 8 channels
    • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
    • Programmable current source
    • 2× UART
    • I2C
    • I2S
    • Real-time clock (RTC)
    • AES 128-bit and 256-bit crypto accelerator
    • ECC and RSA public key hardware accelerator
    • SHA2 accelerator (full suite up to SHA-512)
    • True random number generator (TRNG)
    • Capacitive sensing, up to 8 channels
    • Integrated temperature and battery monitor
  • External system
    • On-chip buck DC/DC converter
  • Ultra-low power sensor controller with 4KB of SRAM
    • Operation independent from system CPU
    • Sample, store, and process sensor data
    • Fast wake-up for low-power operation
  • TI-RTOS in ROM
  • Development Tools and Software
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The SimpleLink™ 2.4 GHz CC2662R-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting wireless automotive applications. The device is optimized for low-power wireless communication in applications such as battery management systems (BMS) and cable replacement. The highlighted features of this device include:

  • Support for TI wireless BMS protocol for robust, low latency and high throughput communication.
  • Functional Safety Quality-Managed classification including TI quality-managed development process and forthcoming functional safety FIT rate calculation, FMEDA and functional safety documentation.
  • AEC-Q100 qualified at the Grade 2 temperature range (–40 °C to +105 °C) and is offered in a 7-mm x 7-mm VQFN package with wettable flanks.
  • Low standby current of 0.94 µA with full RAM retention.
  • Excellent radio link budget of 97 dBm.

The CC2662R-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee®, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment and rich tool set. For more information, visit SimpleLink™ MCU platform.

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Request more information

The TÜV SÜD functional safety concept assessment on the TI battery management system (BMS) is available. Request now

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Technical documentation

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Type Title Date
* Data sheet CC2662R-Q1 SimpleLink™ Wireless BMS MCU datasheet Dec. 11, 2020
* Errata CC2662R-Q1 SimpleLink™ Wireless BMS MCU Silicon Errata Dec. 11, 2020
* User guide CC13x2, CC26x2 SimpleLink™ Wireless MCU Technical Reference Manual (Rev. D) Sep. 30, 2019
Technical article Wireless M-Bus 101: Demystifying modes and regional application profiles Jul. 02, 2021
White paper Exploring Thread and Zigbee for home and building automation Apr. 12, 2021
Technical article Improve wireless battery management with the industry’s best network availability Jan. 07, 2021
Certificate CC2662RQ1-EVM-WBMS EU RoHS Declaration of Conformity (DoC) Dec. 14, 2020
Technical article Three questions to ask about wireless BMS for hybrid and electric vehicles Feb. 18, 2020
User guide Functional Safety-Relevant Wireless Communication in Automotive BMS Jan. 06, 2020
Technical article Bluetooth® Low Energy shifts gears for car access Jul. 15, 2019

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Software development

SimpleLink™ wireless battery management system (BMS) software development kit (SDK)
SIMPLELINK-WBMS-SDK The SimpleLink™ wireless battery management (BMS) software development kit (SDK) provides a comprehensive software package for wireless BMS and cable replacement applications with support for the TI proprietary wireless BMS protocol based on the SimpleLink 2.4 GHz CC2662R-Q1 wireless MCU. This (...)
  • TI SimpleLink wireless BMS SDK enables wireless protocol based on star beacon network optimized for replacing wires and harness in a battery management system.
  • Software operating with black channel principle per ISO26262 providing data integrity mechanisms to assist system integrators to achieve (...)

Design tools & simulation

SWRC366.ZIP (1176 KB)

CAD/CAE symbols

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Ordering & quality

Information included:
  • RoHS
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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Support & training

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