TIDUEZ3B april   2021  – april 2023

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 LMG342xR030
      2. 2.3.2 TMS320F28002x
      3. 2.3.3 OPA607
      4. 2.3.4 UCC21222
  8. 3Hardware, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Test Setup
    3. 3.3 Test Results
      1. 3.3.1 Test Procedures
      2. 3.3.2 Performance Data: Efficiency, iTHD, and Power Factor
      3. 3.3.3 Functional Waveforms
        1. 3.3.3.1 Current Sensing and Protection
        2. 3.3.3.2 Power Stage Start-Up and Input Waveforms
        3. 3.3.3.3 AC Drop Test
        4. 3.3.3.4 Surge Test
        5. 3.3.3.5 EMI Test
      4. 3.3.4 Thermal Test
      5. 3.3.5 GaN FET Switching Waveform
  9. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Documentation Support
    3. 4.3 Support Resources
    4. 4.4 Trademarks
  10. 5About the Author
  11. 6Revision History

Revision History

Changes from Revision A (June 2022) to Revision B (April 2023)

Changes from Revision * (April 2021) to Revision A (June 2022)

  • Updated EMI CE Result After Adding Shielding Copper with 230 Vac, 40-R Load imageGo
  • Added noteGo