TIDUF29 October   2023

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Connectors
      2. 2.2.2 High-Speed Traces
      3. 2.2.3 Power Rails
    3. 2.3 Highlighted Products
      1. 2.3.1 DS560DF410
      2. 2.3.2 TPS62867
      3. 2.3.3 TPS7A52
      4. 2.3.4 TLV702
      5. 2.3.5 TXB0108
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
      1. 3.1.1 TX Output Eye Test
      2. 3.1.2 RX Link Test
    2. 3.2 Software Requirements
    3. 3.3 Test Setup
      1. 3.3.1 TX Output Eye Test
      2. 3.3.2 RX Link Test
    4. 3.4 Test Results
      1. 3.4.1 TX Output Eye Test
      2. 3.4.2 RX Link Test
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
      3. 4.1.3 Altium Project
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks

2.2.1 Connectors

MXP connectors are commonly used on high-speed test and evaluation equipment. TI uses MXP connectors on 25G/28G and 56G Ethernet signal condition device EVMs. Because of this, MXP connecters were also selected to interface with this MCB. There are 4 DS560DF410 devices on each MCB. Two devices handle ingress, and two handle egress. For each device, 3 channels are routed to MXP connectors, and 1 channel is routed to SMA connectors. SMA connectors were added to offer flexibility in case there are challenges acquiring MXP cable assemblies.