TIDUF60 December   2023

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Terminology
    2. 1.2 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 TMS320F2800137
      2. 2.3.2 MSPM0G1507
      3. 2.3.3 TMP6131
      4. 2.3.4 UCC28881
      5. 2.3.5 TPS54202
      6. 2.3.6 TLV9062
      7. 2.3.7 TLV74033
    4. 2.4 System Design Theory
      1. 2.4.1 Hardware Design
        1. 2.4.1.1 Modular Design
        2. 2.4.1.2 High-Voltage Buck Auxiliary Power Supply
        3. 2.4.1.3 DC Link Voltage Sensing
        4. 2.4.1.4 Motor Phase Voltage Sensing
        5. 2.4.1.5 Motor Phase Current Sensing
        6. 2.4.1.6 External Overcurrent Protection
        7. 2.4.1.7 Internal Overcurrent Protection for TMS320F2800F137
      2. 2.4.2 Three-Phase PMSM Drive
        1. 2.4.2.1 Field-Oriented Control of PM Synchronous Motor
          1. 2.4.2.1.1 Space Vector Definition and Projection
            1. 2.4.2.1.1.1 ( a ,   b ) ⇒ ( α , β ) Clarke Transformation
            2. 2.4.2.1.1.2 α , β ⇒ ( d ,   q ) Park Transformation
          2. 2.4.2.1.2 Basic Scheme of FOC for AC Motor
          3. 2.4.2.1.3 Rotor Flux Position
        2. 2.4.2.2 Sensorless Control of PM Synchronous Motor
          1. 2.4.2.2.1 Enhanced Sliding Mode Observer With Phase-Locked Loop
            1. 2.4.2.2.1.1 Mathematical Model and FOC Structure of an IPMSM
            2. 2.4.2.2.1.2 Design of ESMO for the IPMSM
            3. 2.4.2.2.1.3 Rotor Position and Speed Estimation With PLL
        3. 2.4.2.3 Field Weakening (FW) and Maximum Torque Per Ampere (MTPA) Control
        4. 2.4.2.4 Hardware Prerequisites for Motor Drive
          1. 2.4.2.4.1 Motor Current Feedback
            1. 2.4.2.4.1.1 Three-Shunt Current Sensing
            2. 2.4.2.4.1.2 Single-Shunt Current Sensing
          2. 2.4.2.4.2 Motor Voltage Feedback
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Getting Started Hardware
      1. 3.1.1 Hardware Board Overview
      2. 3.1.2 Test Conditions
      3. 3.1.3 Test Equipment Required for Board Validation
    2. 3.2 Getting Started GUI
      1. 3.2.1 Test Setup
      2. 3.2.2 Overview of GUI Software
      3. 3.2.3 Setup Serial Port
      4. 3.2.4 Motor Identification
      5. 3.2.5 Spin Motor
      6. 3.2.6 Motor Fault Status
      7. 3.2.7 Tune Control Parameters
      8. 3.2.8 Virtual Oscilloscope
    3. 3.3 Getting Started C2000 Firmware
      1. 3.3.1 Download and Install Software Required for Board Test
      2. 3.3.2 Opening Project Inside CCS
      3. 3.3.3 Project Structure
      4. 3.3.4 Test Procedure
        1. 3.3.4.1 Build Level 1: CPU and Board Setup
          1. 3.3.4.1.1 Start CCS and Open Project
          2. 3.3.4.1.2 Build and Load Project
          3. 3.3.4.1.3 Setup Debug Environment Windows
          4. 3.3.4.1.4 Run the Code
        2. 3.3.4.2 Build Level 2: Open-Loop Check With ADC Feedback
          1. 3.3.4.2.1 Start CCS and Open Project
          2. 3.3.4.2.2 Build and Load Project
          3. 3.3.4.2.3 Setup Debug Environment Windows
          4. 3.3.4.2.4 Run the Code
        3. 3.3.4.3 Build Level 3: Closed Current Loop Check
          1. 3.3.4.3.1 Start CCS and Open Project
          2. 3.3.4.3.2 Build and Load Project
          3. 3.3.4.3.3 Setup Debug Environment Windows
          4. 3.3.4.3.4 Run the Code
        4. 3.3.4.4 Build Level 4: Full Motor Drive Control
          1. 3.3.4.4.1 Start CCS and Open Project
          2. 3.3.4.4.2 Build and Load Project
          3. 3.3.4.4.3 Setup Debug Environment Windows
          4. 3.3.4.4.4 Run the Code
          5. 3.3.4.4.5 Tuning Motor Drive FOC Parameters
          6. 3.3.4.4.6 Tuning Field Weakening and MTPA Control Parameters
          7. 3.3.4.4.7 Tuning Current Sensing Parameters
    4. 3.4 Test Results
      1. 3.4.1 Load and Thermal Test
      2. 3.4.2 Overcurrent Protection by External Comparator
      3. 3.4.3 Overcurrent Protection by Internal CMPSS
    5. 3.5 Migrate Firmware to a New Hardware Board
      1. 3.5.1 Configure the PWM, CMPSS, and ADC Modules
      2. 3.5.2 Setup Hardware Board Parameters
      3. 3.5.3 Configure Faults Protection Parameters
      4. 3.5.4 Setup Motor Electrical Parameters
    6. 3.6 Getting Started MSPM0 Firmware
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 Bill of Materials
      3. 4.1.3 PCB Layout Recommendations
      4. 4.1.4 Altium Project
      5. 4.1.5 Gerber Files
    2. 4.2 Software Files
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author

1.2 Key System Specifications

The TIDA-010265 specifications are listed in Table 1-1.

Table 1-1 Key System Specifications

Parameters

TEST CONDITIONSMINNOMMAXUNIT
SYSTEM INPUT CHARACTERISTICS
Input Voltage (VINAC)–165230265VAC

Input Frequency (fLINE)

–475063Hz

No Load Standby Power (PNL)

VINAC = 230 V, Iout = 0 A–3.0–W

Input Current (IIN)

VINAC = 230 V, Iout

= IMAX

–

8

–A

MOTOR INVERTER CHARACTERSITICS

PWM switching frequency (fSW)

––15

20

kHz

Rated output power (POUT)

VINAC = nom–500

750

W

Output current (IRMS)

VINAC = nom–

3

–A

Inverter efficiency (Ƞ)

VINAC = nom, POUT

= nom

–98–%

Motor electrical frequency (f)

VINAC = min to max20200400Hz

Fault protections

Overcurrent, stall with recovery, undervoltage, overvoltage

Drive control method and features

Sensorless-FOC with three or single shunt resistors for current sensing
SYSTEM CHARACTERISTICS

Built-in auxiliary power supply

VINAC = min to max

15 V ±10%, 200 mA , 3.3 V ±10%, 300 mA

Operating ambient

Open frame–102555°C

Board size

Length × width × height

105 mm × 85 mm × 60 mm

mm3
WARNING:

TI intends this reference design to be operated in a lab environment only and does not consider the device to be a finished product for general consumer use.

TI Intends this reference design to be used only by qualified engineers and technicians familiar with risks associated with handling high-voltage electrical and mechanical components, systems, and subsystems.

High voltage! There are accessible high voltages present on the board. The board operates at voltages and currents that can cause shock, fire, or injury if not properly handled or applied. Use the equipment with necessary caution and appropriate safeguards to avoid injuring yourself or damaging property.

Hot surface! Contact can cause burns. Do not touch! Some components can reach high temperatures > 55°C when the board is powered on. The user must not touch the board at any point during operation or immediately after operating, as high temperatures can be present.

CAUTION: Do not leave the design powered when unattended.