TIDUFA0A February   2025  – March 2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Switching Frequency
      2. 2.2.2 Design Size
      3. 2.2.3 Gate Resistors
      4. 2.2.4 Output Ripple
      5. 2.2.5 FET Placement
    3. 2.3 Highlighted Products
      1. 2.3.1 TPS7H5004-SP
      2. 2.3.2 TPS7H6023-SP
  9. 3Hardware, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Test Setup
    3. 3.3 Test Results
      1. 3.3.1 Efficiency Graphs
      2. 3.3.2 Bode Plot
      3. 3.3.3 Switching
      4. 3.3.4 Output Ripple
      5. 3.3.5 Gate Signals
      6. 3.3.6 Start-Up Sequence
      7. 3.3.7 Load Transient
      8. 3.3.8 Thermal Images
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Tools
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author
  12. 6Revision History

Design Size

Another key consideration in this design was creating a small design size while having a good efficiency. Generally, more compact designs have less space for cooling, causing heat dissipation problems, leading to reduced performance abilities. Additionally, placing components closely together can cause signal interference and a need for higher routing accuracy. This design prioritized having a small and compact design size while maintaining a reasonable efficiency.