TIDUFB0 July   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Input Devices (DALI 103)
    2. 1.2 Control Gear (DALI 102)
    3. 1.3 Control Devices (Application Controllers)
    4. 1.4 Introduction
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Manchester Encoding
      2. 2.2.2 Using Opto-Emulators Instead of Optocouplers
    3. 2.3 Highlighted Products
      1. 2.3.1 MSPM0G350x
      2. 2.3.2 ISOM8111
        1. 2.3.2.1 ISOM8111 Features
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Software Requirements
      1. 3.2.1 DALI Stack Layer
    3. 3.3 Test Setup
      1. 3.3.1 Configuring the PIR
    4. 3.4 Test Results
      1. 3.4.1 Event Message When PIR Detects a Motion
      2. 3.4.2 Event Message Generation Through Report Timer
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
      3. 4.1.3 PCB Layout Recommendations
        1. 4.1.3.1 Layout Prints
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Authors

3.1 Hardware Requirements

To evaluate DALI 103 (303) communication, the following hardware components are required:

  1. 2 × LP-MSPM0G3507 evaluation boards
  2. 2 × DALI HW interface (TIDA-010963)
  3. 24V DC power supply with barrel jack connector

Figure 3-1 depicts a comprehensive system diagram, illustrating the connections between two LaunchPads. The LaunchPad on the left serves as the Device Under Test (DUT), featuring a PIR sensor and external 24VDC supply enabled using the J1, J6, and J7 jumpers. On the right side, a separate LaunchPad is employed to transmit commands to the DUT during run time, facilitating a precise testing procedure.

This setup is designed to validate that the DUT accurately receives and responds to commands from the DALI bus.

TIDA-010963 Connections Between Two LaunchPad™ Development KitsFigure 3-1 Connections Between Two LaunchPad™ Development Kits