TIDUFE7 March   2026

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 MSPM0G5187 Mixed-Signal Microcontrollers With Edge AI NPU
      2. 2.3.2 CC2755R10 SimpleLink™ Bluetooth® LE wireless MCU
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
      1. 3.1.1 PIR Analog Signal Chain
    2. 3.2 Software Requirements
    3. 3.3 Test Setup
      1. 3.3.1 Data Collection
    4. 3.4 Test Results
      1. 3.4.1 Passive Infrared Sensor (PIR)
      2. 3.4.2 HDC3020 – Temperature and Humidity Sensor (I2C)
      3. 3.4.3 BMP384 – Barometric Pressure Sensor (I2C)
      4. 3.4.4 OPT4001 – Ambient Light Sensor (I2C)
      5. 3.4.5 BMI270 – 6-Axis IMU (SPI)
      6. 3.4.6 MAG5170 – 3D Hall-Effect Sensor (SPI)
      7. 3.4.7 ICS43434 – Digital Microphone (I2S)
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author

3.3 Test Setup

Figure 3-7 illustrates the complete test configuration. The MSPM0 EVM is physically connected to the Sensors BoosterPack, serving as the main processing and control unit. The EVM provides power, communication interfaces, and data handling for each of the onboard time-series sensors. The MSPM0 EVM is interfaced with the Edge AI Studio platform, which enables real-time data collection.

TIDA-010997 Software Flow Figure 3-7 Software Flow