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Microstar Chip Scale Packages (�CSP) are�rectangular in shape with solder ball connections on the bottom side of the package. The grid arrangement of the �CSP package allows high pin count and a popular package for a wide range of applications. It is not recommended for new designs at this time.
Micro ChipScale Package (uCSP)
10 total package options for the Texas Instruments Micro ChipScale Package (uCSP).
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