Find TI packages
TI’s broad packaging portfolio supports thousands of diversified products, packaging configurations and technologies, including traditional ceramic and leaded options, to advanced chip scale packages (Quad Flat No Lead (QFN), Wafer Chip Scale Package (WCSP) or Die-Size Ball Grid Array (DSBGA)), using fine pitch wire bond and flip chip interconnects, with SiP, module, stacked and embedded die formats offered.
Select a package family below to view the options. You can also search all TI packages to explore TI’s complete package portfolio. A complete description of TI package families can be found here.
Small form factor for low-to-moderate pin count devices
Flat, square body with leads or pads on all four size and no exposed pad
