Find TI packages

TI’s broad packaging portfolio supports thousands of diversified products, packaging configurations and technologies, including traditional ceramic and leaded options, to advanced chip scale packages (Quad Flat No Lead (QFN), Wafer Chip Scale Package (WCSP) or Die-Size Ball Grid Array (DSBGA)), using fine pitch wire bond and flip chip interconnects, with SiP, module, stacked and embedded die formats offered. 

Select a package family below to view the options. You can also search all TI packages to explore TI’s complete package portfolio. A complete description of TI package families can be found here.


High ball count grid array package

Ceramic rectangular package with leads on opposite sides

Well suited for high pin-count, fine pitch applications

Dual row through-hole package

Custom packages for DMD display and controller chips

Small form factor for low-to-moderate pin count devices

High-pin-density solution in a miniature package

Flat, square body with leads or pads on all four size and no exposed pad

Fully integrated with active die and passives

High pin count, leaded substrate package

Thin profile no-lead package, enhanced thermal performance

Leaded package on four sides, enhanced thermal

Leaded package with leads on opposite sides

Low lead inductance, thin profile for handheld applications

Through-hole package with small footprint

High pin capacity for compact systems