TechNexion

System on module vendor for TI Arm-based processors with in-house manufacturing and design services

Created up in 2001 with a mission to reduce the cost and time spent to develop embedded devices, TechNexion has become one of the most respected and fastest growing embedded systems solution providers. TechNexion's system on modules, embedded mainboards, fan-less embedded computers and panel PCs have enabled some of the biggest OEM/ODMs to create successful products used by the multimedia, communications, security, automation and process control industries.

Continuously investing in the latest production technologies, state-of-the-art equipment upgrades and R&D so that all products deliver the benefits of the latest technology, no matter how complex. TechNexion also backs up all products and solutions with an industry-leading longevity commitment, open hardware documentation and open source software.

Arm-based processors

AM623 — Internet of Things (IoT) and gateway SoC with Arm® Cortex®-A53-based object and gesture recognition

AM625 — Human-machine-interaction SoC with Arm® Cortex®-A53-based edge AI and full-HD dual display

TDA4VM — Dual Arm® Cortex®-A72 SoC and C7x DSP with deep-learning, vision and multimedia accelerators

FPD-Link SerDes

DS90UB953-Q1 — 2 MP MIPI® CSI-2 FPD-Link III serializer for 2MP/60fps cameras & radar

V3Link SerDes

TSER953 — 4.16-Gbps MIPI® CSI-2 V³Link serializer for high speed sensors

Contact

Resources offered

Evaluation board

Supported regions

Africa
China
Europe
India
Japan
North America
Oceania
Rest of Asia
South America

Headquarters

16F-5, No. 736, Zhongzheng Road, ZhongHe District, 23511
New Taipei City, Taiwan
New Taipei City, Taiwan, 23511
Taiwan

Resources

Evaluation board

TECHN-3P-SOM-AXON-AM62 — Technexion AXON-AM62x system on module for AM6254 quad Cortex-A53 1.4 GHz processor

The AXON-AM62x system-on-module (SOM) is the edge processing solution for applications requiring the highest amount of I/O for sensory input, actuation control and edge processing. At just 37 mm × 58 mm, with a PCB footprint optimized board-to-board connector, AXON modules integrate the (...)

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Evaluation board

TECHN-3P-SOM-ROVY-4VM — TechNexion ROVY-4VM system-on-module for TDA4VM SoC with dual Arm® Cortex®-A72 C7x DSP GPU

The TechNexion ROVY-4VM is a system-on-module (SOM) developed for mobile robotic, industrial automation and machine vision applications. This SOM is designed for real-time processing in embedded vision applications. The TDA4VM SOC integrates dual ARM®v8 Cortex® A72, 6x 1.0 GHz ARM Cortex (...)

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Evaluation board

TECHN-3P-TEVI-OV5640 — TechNexion TEVI-OV5640 evaluation kits for OV5640 camera module with FFC connector

Camera module evaluation kit from TechNexion compatible with evaluation modules (EVMs) and single-board computers (SBCs) featuring AM6x processors.

Sensor - OmniVision OV5640 MIPI-CSI2 CMOS image sensor: up to 5MP resolution, color, rolling shutter, and on-chip ISP.

Lens - 84 Degree M12 Lens with (...)

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Evaluation board

TECHN-3P-VLI-X-SL — TechNexion VizionLink fully-enclosed, IP68 camera modules based on FPD-Link III serializers, S-mount

Fully-enclosed, IP68 camera modules from TechNexion based on FPD-Link III serializers compatible with evaluation modules (EVMs) and single-board computers (SBCs) featuring AM6x and TDA4x processors.

Each camera module is based on color image sensors with varying resolution and performance for a (...)

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