The ISO7230 and ISO7231 are triple-channel digital isolators each with multiple channel configurations and output enable functions. These devices have logic input and output buffers separated by TI’s silicon dioxide (SiO2) isolation barrier. Used in conjunction with isolated power supplies, these devices block high voltage, isolate grounds, and prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry.
| Top documentation | Type | Title | Format options | Date |
|---|---|---|---|---|
| * | Data sheet | ISO723xx High-Speed, Triple-Channel Digital Isolators datasheet (Rev. N) | PDF | HTML | Oct 17, 2025 |
| Certificate | VDE Certificate for Basic Isolation for DIN EN IEC 60747-17 (Rev. AA) | Jun 11, 2026 | ||
| White paper | Improve Your System Performance by Replacing Optocouplers with Digital Isolators (Rev. D) | PDF | HTML | Nov 7, 2025 | |
| Certificate | CSA Certificate for ISO72xxDW (Rev. A) | Aug 20, 2025 | ||
| Application note | Digital Isolator Design Guide (Rev. G) | PDF | HTML | Sep 13, 2023 | |
| Certificate | UL Certificate of Compliance File E181974 Vol 4 Sec 1 (Rev. A) | Aug 5, 2022 | ||
| White paper | Why are Digital Isolators Certified to Meet Electrical Equipment Standards? | Nov 16, 2021 | ||
| White paper | Distance Through Insulation: How Digital Isolators Meet Certification Requiremen | PDF | HTML | Jun 11, 2021 | |
| Application brief | Considerations for Selecting Digital Isolators | Jul 24, 2018 |
For additional terms or required resources, click any title below to view the detail page where available.
DIGI-ISO-EVM is an evaluation module (EVM) used to evaluate any of the TI single-channel, dual-channel, triple-channel, quad-channel or six-channel digital isolator devices in five different packages - 8-pin narrow-body SOIC (D), 8-pin wide-body SOIC (DWV), 16-pin wide-body SOIC (DW), 16-pin ultra- (...)
The ISO723X724X evaluation module (EVM) supports the rapid, parametric evaluation of the Triple and Quad Digital Isolators. The EVM will be delivered with an ISO7241C soldered on the board. If another device is desired, please order samples from www.ti.com. If you do not have the capability to (...)
LAUNCHXL-F28379D is a low-cost evaluation and development tool for the TMS320F2837xD, TMS320F2837xS, and TMS320F2807x products in the TI MCU LaunchPad™ development kit ecosystem which is compatible with various plug-on BoosterPacks (suggested under the recommended BoosterPack™ Plug-in (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| SOIC (DW) | 16 | Ultra Librarian |
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