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CD74HCT574-EP

ACTIVO

Flip-Flops tipo D con activación de borde positivo octal y CMOS Logic de alta velocidad de producció

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CD74HCT574-EP

ACTIVO
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Detalles del producto

Number of channels 8 Technology family HCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 25 IOL (max) (mA) 6 IOH (max) (mA) -6 Supply current (max) (µA) 80 Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Operating temperature range (°C) -40 to 125 Rating HiRel Enhanced Product
Number of channels 8 Technology family HCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 25 IOL (max) (mA) 6 IOH (max) (mA) -6 Supply current (max) (µA) 80 Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Operating temperature range (°C) -40 to 125 Rating HiRel Enhanced Product
SOIC (DW) 20 131.84 mm² 12.8 x 10.3 TSSOP (PW) 20 41.6 mm² 6.5 x 6.4
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification
  • Qualification Pedigree
  • Buffered Inputs
  • Common 3-State Output-Enable Control
  • 3-State Outputs
  • Bus-Line Driving Capability
  • Typical Propagation Delay (Clock to Q):
       15 ns at VCC = 5 V, CL = 15 pF, TA = 25°C
  • Fanout (Over Temperature Range)
    • Standard Outputs . . . 10 LSTTL Loads
    • Bus Driver Outputs . . . 15 LSTTL Loads
  • Balanced Propagation Delay and Transition Times
  • Significant Power Reduction Compared to LSTTL Logic ICs
  • VCC Voltage = 4.5 V to 5.5 V
  • Direct LSTTL Input Logic Compatibility, VIL = 0.8 V (Max), VIH = 2 V (Min)
  • CMOS Input Compatibility, Il ≤ 1 µA at VOL, VOH

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification
  • Qualification Pedigree
  • Buffered Inputs
  • Common 3-State Output-Enable Control
  • 3-State Outputs
  • Bus-Line Driving Capability
  • Typical Propagation Delay (Clock to Q):
       15 ns at VCC = 5 V, CL = 15 pF, TA = 25°C
  • Fanout (Over Temperature Range)
    • Standard Outputs . . . 10 LSTTL Loads
    • Bus Driver Outputs . . . 15 LSTTL Loads
  • Balanced Propagation Delay and Transition Times
  • Significant Power Reduction Compared to LSTTL Logic ICs
  • VCC Voltage = 4.5 V to 5.5 V
  • Direct LSTTL Input Logic Compatibility, VIL = 0.8 V (Max), VIH = 2 V (Min)
  • CMOS Input Compatibility, Il ≤ 1 µA at VOL, VOH

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The CD74HCT574 is an octal D-type flip-flop with 3-state outputs and the capability to drive 15 LSTTL loads. The eight edge-triggered flip-flops enter data into their registers on the low-to-high transition of the clock (CP). The output enable (OE)\ controls the 3-state outputs and is independent of the register operation. When OE\ is high, the outputs are in the high-impedance state.

The CD74HCT574 is an octal D-type flip-flop with 3-state outputs and the capability to drive 15 LSTTL loads. The eight edge-triggered flip-flops enter data into their registers on the low-to-high transition of the clock (CP). The output enable (OE)\ controls the 3-state outputs and is independent of the register operation. When OE\ is high, the outputs are in the high-impedance state.
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Documentación técnica

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Tipo Título Fecha
* Data sheet CD74HCT574-EP datasheet 06 feb 2004
* VID CD74HCT574-EP VID V6204739 21 jun 2016
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 dic 2022
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
User guide Signal Switch Data Book (Rev. A) 14 nov 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 jun 1997
Application note Designing With Logic (Rev. C) 01 jun 1997
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 01 may 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 abr 1996

Diseño y desarrollo

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Paquete Pasadores Descargar
SOIC (DW) 20 Ver opciones
TSSOP (PW) 20 Ver opciones
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Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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