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LMZ31710

ACTIVO

Módulo de alimentación reductor de 2,95 V a 17 V, 10 A, con corriente compartida en paquete QFN de 1

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Detalles del producto

Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 10 Vin (min) (V) 2.95 Vin (max) (V) 17 Vout (min) (V) 0.6 Vout (max) (V) 5.5 Switching frequency (min) (kHz) 200 Switching frequency (max) (kHz) 1200 Features Current Sharing, EMI Tested, Frequency synchronization, Light Load Efficiency, Power good, Remote Sense, Tracking Control mode current mode Duty cycle (max) (%) 100
Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 10 Vin (min) (V) 2.95 Vin (max) (V) 17 Vout (min) (V) 0.6 Vout (max) (V) 5.5 Switching frequency (min) (kHz) 200 Switching frequency (max) (kHz) 1200 Features Current Sharing, EMI Tested, Frequency synchronization, Light Load Efficiency, Power good, Remote Sense, Tracking Control mode current mode Duty cycle (max) (%) 100
B3QFN (RVQ) 42 100 mm² 10 x 10
  • Complete integrated power solution
    • Small footprint, low-profile design
    • Pin compatible with LMZ31707 and LMZ31704
    • 10-mm × 10-mm × 4.3-mm package
  • Efficiencies up to 95%
  • Eco-Mode™ and light load efficiency (LLE)
  • Wide-output voltage adjust
    0.6 V to 5.5 V, With 1% reference accuracy
  • Supports parallel operation for higher current
  • Optional split power rail allows
    input voltage down to 2.95 V
  • Adjustable switching frequency
    (200 kHz to 1.2 MHz)
  • Synchronizes to an external clock
  • Provides 180° out-of-phase clock signal
  • Adjustable slow start
  • Output voltage sequencing and tracking
  • Power-good output
  • Programmable undervoltage lockout (UVLO)
  • Overcurrent and overtemperature protection
  • Prebias output start-up
  • Operating temperature range: –40°C to +85°C
  • Enhanced thermal performance: 13.3°C/W
  • Meets EN55022 Class B emissions
    - integrated shielded inductor
  • Create a custom design using the LMZ31710 with the WEBENCH® Power Designer
  • Complete integrated power solution
    • Small footprint, low-profile design
    • Pin compatible with LMZ31707 and LMZ31704
    • 10-mm × 10-mm × 4.3-mm package
  • Efficiencies up to 95%
  • Eco-Mode™ and light load efficiency (LLE)
  • Wide-output voltage adjust
    0.6 V to 5.5 V, With 1% reference accuracy
  • Supports parallel operation for higher current
  • Optional split power rail allows
    input voltage down to 2.95 V
  • Adjustable switching frequency
    (200 kHz to 1.2 MHz)
  • Synchronizes to an external clock
  • Provides 180° out-of-phase clock signal
  • Adjustable slow start
  • Output voltage sequencing and tracking
  • Power-good output
  • Programmable undervoltage lockout (UVLO)
  • Overcurrent and overtemperature protection
  • Prebias output start-up
  • Operating temperature range: –40°C to +85°C
  • Enhanced thermal performance: 13.3°C/W
  • Meets EN55022 Class B emissions
    - integrated shielded inductor
  • Create a custom design using the LMZ31710 with the WEBENCH® Power Designer

The LMZ31710 power module is an easy-to-use integrated power solution that combines a 10-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low-profile QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.

The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. The device achieves greater than 95% efficiency and excellent power dissipation capability with a thermal impedance of 13.3°C/W. The LMZ31710 offers the flexibility and the feature set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

The LMZ31710 power module is an easy-to-use integrated power solution that combines a 10-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low-profile QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.

The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. The device achieves greater than 95% efficiency and excellent power dissipation capability with a thermal impedance of 13.3°C/W. The LMZ31710 offers the flexibility and the feature set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

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Documentación técnica

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Tipo Título Fecha
* Data sheet LMZ31710 10-A Module, 2.95-V to 17-V Input and Current Sharing in QFN Package datasheet (Rev. F) 22 abr 2020
Application note Soldering Considerations for Power Modules (Rev. C) PDF | HTML 14 mar 2024
User guide LMZ31704 2-Phase Power Module Evaluation Module User's Guide (Rev. A) PDF | HTML 31 ene 2022
User guide LMZ3170x Power Module Evaluation Module User's Guide (Rev. B) PDF | HTML 31 ene 2022
Selection guide Innovative DC/DC Power Modules Selection Guide (Rev. D) 14 oct 2021
Application note Soldering Requirements for BQFN Packages (Rev. C) 05 mar 2020
Application note Practical Thermal Design With DC/DC Power Modules (Rev. A) 20 nov 2019
Technical article FPGA power made simple: design steps PDF | HTML 20 nov 2017
White paper Simplify low EMI design with power modules 20 nov 2017
Technical article Making trade-offs when integrating input and output capacitors in a DC/DC step-dow PDF | HTML 11 sep 2017
White paper Benefits and trade-offs of various power-module package options 02 ago 2017
Application note Working With QFN Power Modules (Rev. A) 08 jun 2017
Application note Power Module MSL Ratings 20 ene 2017
Application note Using LMZ31710 for Higher Output Voltages 09 nov 2015
Technical article Power up with SIMPLE SWITCHER® products and new WEBENCH® tools PDF | HTML 08 jul 2015
Application note Adjusting LMZ3 Output Voltage with LM10010/1 11 feb 2014
Application note LMZ31710, LMZ31707, LMZ31704 Parallel 02 jul 2013
Application note Powering LMZ3 SIMPLE SWITCHER Power Modules From 3.3 V 02 jul 2013

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

LMZ31710EVM-001 — Placa de evaluación del módulo de alimentación reductor LMZ31710 de 2,95 V a 17 V, 10 A

The LMZ31710 EVM is designed to help the user easily evaluate and test the operation and functionality of the LMZ31710 buck module. The EVM convert a 2.95-V to 17-V input voltage to a regulated 0.6-V to 5-V output voltage that delivers up to 10 A in a 10-mm x 10-mm QFN package. The output (...)

Guía del usuario: PDF | HTML
Placa de evaluación

LMZ31710X2EVM — Placa paralela LMZ31710

The LMZ31710X2EVM is designed to help the user easily evaluate and test the operation and functionality of the LMZ31710 buck module in two-phase configuration. The EVM convert a 2.95-V to 17-V input voltage to a regulated output voltage (0.6 V, 0.9 V, 1.2 V, and 1.8 V selected using a jumper) that (...)

Guía del usuario: PDF | HTML
Modelo de simulación

LMZ31710 PSpice Average Model

SNVM523.ZIP (31 KB) - PSpice Model
Modelo de simulación

LMZ31710 PSpice Transient Model

SNVM541.ZIP (129 KB) - PSpice Model
Modelo de simulación

LMZ31710 Unencrypted PSpice Transient Model

SNVM791.ZIP (7 KB) - PSpice Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
B3QFN (RVQ) 42 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

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