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SN74LVT573

ACTIVO

Bloqueos octales transparentes de tipo D ABT de 3.3 V con salidas de 3 estados

Detalles del producto

Number of channels 8 Technology family LVT Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 160 IOL (max) (mA) 16 IOH (max) (mA) -16 Supply current (max) (µA) 5000 Features High speed (tpd 10-50ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 8 Technology family LVT Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 160 IOL (max) (mA) 16 IOH (max) (mA) -16 Supply current (max) (µA) 5000 Features High speed (tpd 10-50ns) Operating temperature range (°C) -40 to 85 Rating Catalog
SOIC (DW) 20 131.84 mm² (12.8 mm × 10.3 mm) TSSOP (PW) 20 41.6 mm² (6.5 mm × 6.4 mm)
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)< 0.8 V at VCC = 3.3 V, TA = 25°C
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
  • Support Live Insertion
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Packages, and Ceramic (J) DIPs
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)< 0.8 V at VCC = 3.3 V, TA = 25°C
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
  • Support Live Insertion
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Packages, and Ceramic (J) DIPs

These octal latches are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The eight latches of the 'LVT573 are transparent D-type latches. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.

A buffered output-enable input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT573 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVT573 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT573 is characterized for operation from -40°C to 85°C.

These octal latches are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The eight latches of the 'LVT573 are transparent D-type latches. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.

A buffered output-enable input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT573 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVT573 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT573 is characterized for operation from -40°C to 85°C.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Descargar la versión más reciente en inglés Fecha
* Hoja de datos 3.3-V ABT Octal Transparent D-Type Latches datasheet (Rev. D) 1/07/1995

Diseño y desarrollo

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Placa de evaluación

14-24-LOGIC-EVM — Módulo de evaluación genérico de productos lógicos para encapsulados D, DB, DGV, DW, DYY, NS y PW de

El módulo de evaluación (EVM) 14-24-LOGIC-EVM está diseñado para admitir cualquier dispositivo lógico que se encuentre en un encapsulado D, DW, DB, NS, PW, DYY o DGV de 14 a 24 pines.

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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SOIC (DW) 20 Ultra Librarian
TSSOP (PW) 20 Ultra Librarian

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